購買 MG1250H-XN2MM與BYCHPS
購買即有保證
MG1250H-XN2MM
- 型號:
- MG1250H-XN2MM
- 製造商:
- Littelfuse
- 描述:
- IGBT MOD 1200V 50A PKG H CRCT:X
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17841 Pieces
簡單介紹
BYCHIPS是 MG1250H-XN2MM的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MG1250H-XN2MM購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 1200V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 1.7V @ 15V, 50A (Typ) |
| 供應商設備封裝: | Module |
| 系列: | - |
| 功率 - 最大: | 260W |
| 封裝/箱體: | Module |
| 其他名稱: | F6702 MG1250H-XN2MM-ND |
| 工作溫度: | -40°C ~ 125°C (TJ) |
| NTC熱敏電阻: | Yes |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | MG1250H-XN2MM |
| 輸入電容（連鎖商店）@的Vce: | 3.6nF @ 25V |
| 輸入: | Standard |
| IGBT類型: | Trench Field Stop |
| 展開說明: | IGBT Module Trench Field Stop Three Phase Inverter 1200V 75A 260W Chassis Mount Module |
| 描述: | IGBT MOD 1200V 50A PKG H CRCT:X |
| 電流 - 集電極截止（最大）: | 1mA |
| 電流 - 集電極（Ic）（最大）: | 75A |
| 組態: | Three Phase Inverter |
| Email: | [email protected] |
MG1250H-XN2MM的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MG1250W-XBN2MM | Littelfuse Inc. | IGBT MOD 1200V 50A PKG W CRCT:XB | 在線詢價 |
 |
MG1250S-BA1MM | Littelfuse Inc. | IGBT 1200V 80A 500W PKG S | 在線詢價 |
 |
VIO50-12P1 | IXYS | MOD IGBT DIODE SGL 1200V ECOPAC2 | 在線詢價 |
 |
APTGT100A170D1G | Microsemi Corporation | IGBT MODULE TRENCH PHASE LEG D1 | 在線詢價 |
 |
CM300DX-24S1 | Powerex Inc. | IGBT MOD NX 300A 1200V DUAL | 在線詢價 |
 |
FZ800R33KL2CB5NOSA1 | Infineon Technologies | IGBT MODULE 3300V IHV 130MM | 在線詢價 |
|
IRG5U200SD12B | Infineon Technologies | MOD IGBT 1200V 200A POWIR 62 | 在線詢價 |
|
APTGT50TL60T3G | Microsemi Corporation | MOD IGBT 600V 80A SP3 | 在線詢價 |
 |
CM100TU-12H | Powerex Inc. | IGBT MOD 6PAC 600V 100A U SER | 在線詢價 |
|
CM400DU-24F | Powerex Inc. | IGBT MOD DUAL 1200V 400A F SER | 在線詢價 |
 |
CM1400DU-24NF | Powerex Inc. | IGBT MOD DUAL 1200V 1400A MEGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers