購買 MBRB30H80CT-1G與BYCHPS
購買即有保證
MBRB30H80CT-1G
- 型號:
- MBRB30H80CT-1G
- 描述:
- DIODE ARRAY SCHOTTKY 80V I2PAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14250 Pieces
簡單介紹
BYCHIPS是 MBRB30H80CT-1G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MBRB30H80CT-1G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 正向（Vf）（最大）: | 780mV @ 15A |
|---|---|
| 電壓 - （Vr）（最大）: | 80V |
| 供應商設備封裝: | I2PAK (TO-262) |
| 速度: | Fast Recovery = 200mA (Io) |
| 系列: | SWITCHMODE™ |
| 封装: | Tube |
| 封裝/箱體: | TO-262-3 Long Leads, I²Pak, TO-262AA |
| 工作溫度 - 結: | -20°C ~ 150°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | MBRB30H80CT-1G |
| 展開說明: | Diode Array 1 Pair Common Cathode Schottky 80V 15A Through Hole TO-262-3 Long Leads, I²Pak, TO-262AA |
| 二極管類型: | Schottky |
| 二極管配置: | 1 Pair Common Cathode |
| 描述: | DIODE ARRAY SCHOTTKY 80V I2PAK |
| 電流 - Vr時反向漏電: | 250µA @ 80V |
| 電流 - 平均整流（Io）（每二極管）: | 15A |
| Email: | [email protected] |
MBRB30H80CT-1G的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MBRB3030CTG | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V D2PAK | 在線詢價 |
 |
MBRB30H30CT-1G | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V I2PAK | 在線詢價 |
|
MBRB30H60CT-1G | ON Semiconductor | DIODE ARRAY SCHOTTKY 60V I2PAK | 在線詢價 |
|
MBRB3030CTT4G | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V D2PAK | 在線詢價 |
|
MBRB30H60CTT4G | ON Semiconductor | DIODE SCHOTTKY 60V 15A D2PAK | 在線詢價 |
|
MBRB3030CTLG | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V D2PAK | 在線詢價 |
|
MBRB3045CT-1G | ON Semiconductor | DIODE ARRAY SCHOTTKY 45V I2PAK | 在線詢價 |
|
MBRB3030CT | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V D2PAK | 在線詢價 |
|
MBRB3030CTT4 | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V D2PAK | 在線詢價 |
|
MBRB3030CTL | ON Semiconductor | DIODE ARRAY SCHOTTKY 30V D2PAK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers