繁体版
English
Deutsch
Français
русский
español
Português
日本語
Italia
한국의
العربية
Türk dili
polski
Suomi
Indonesia
Tiếng Việt
ภาษาไทย
Nederland
Pilipino
Čeština
繁体中文
Magyarország
Kongeriket
Dansk
Svenska
✕
關於我們
|
聯繫我們
|
在線詢價
|
首 頁
關於Bychips
產品展示
製造商
要求報價
新聞媒體
聯繫Bychips
首 頁
>
產品展示
>
集成電路IC
>
微控制器MCU IC
>
MB96F007ABPMC1-GE1
MB96F007ABPMC1-GE1
型號:
MB96F007ABPMC1-GE1
製造商:
Cypress Semiconductor
描述:
IC MCU FLASH MICOM-0.18 64LQFP
無鉛狀態/ RoHS狀態:
無鉛/符合RoHS
庫存數量:
14561 Pieces
數據表:
MB96F007ABPMC1-GE1.pdf
在線詢價
簡單介紹
BYCHIPS是
MB96F007ABPMC1-GE1的现货代理商,我們有庫存立即運輸,也可供長時間供應。請寄給我們您的
MB96F007ABPMC1-GE1
購買計劃
通過電子郵件,我們會根據您的計劃給您最優惠的價格。
購買
MB96F007ABPMC1-GE1與BYCHPS
購買即有保證
產品特性
系列:
*
濕度敏感度(MSL):
3 (168 Hours)
製造商零件編號:
MB96F007ABPMC1-GE1
展開說明:
* Microcontroller IC
描述:
IC MCU FLASH MICOM-0.18 64LQFP
Email:
[email protected]
快速詢價
型號
數量
公司
邮箱
電話
要求
MB96F007ABPMC1-GE1
的相似型號
圖片
型號
製造商
描述
查看
MB96F004RAPMC-GS-JAE1
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
MB96F004RAPMC-GSE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
MB96F003RAPMC-GSE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
MB96F007ABPMC1-GSAE1
Cypress Semiconductor Corp
IC MCU FLASH MICOM-0.18 64LQFP
在線詢價
MB96F003RAPMC-GE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
MB96F007ABPMC1-G-N2E1
Cypress Semiconductor Corp
IC MCU FLASH MICOM-0.18 64LQFP
在線詢價
MB96F004RAPMC-GE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
MB96F001YBPMC1-GSE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 64LQFP
在線詢價
MB96F001YBPMC1-GS-JKE1
Cypress Semiconductor Corp
IC MCU MICOM CU80M 64LQFP
在線詢價
MB96F007ABPMC-GSE1
Cypress Semiconductor Corp
IC MCU FLASH MICOM-0.35 64LQFP
在線詢價
MB96F004YAPMC-GE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
MB96F001YBPMC1-GSE1
Cypress Semiconductor Corp
IC MCU MICOM CU80M 64LQFP
在線詢價
MB96F003YAPMC-GE2
Cypress Semiconductor Corp
IC MCU MICOM CU80M 120LQFP
在線詢價
最新資訊
Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
Janet Clark to join TI board of directors
TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
GCHQ Director calls for international cyber pact
Embedded World: Arm introduces fourth security element to PSA
Last chance: Nominate BrightSparks before 28 February
Embedded World 2019: Get the full Electronics Weekly Guide
"Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers