購買 M30R334K1與BYCHPS
購買即有保證
M30R334K1
- 型號:
- M30R334K1
- 描述:
- CAP CER 0.33UF 100V X7R RADIAL
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 16780 Pieces
- 數據表:
- M30R334K1.pdf
簡單介紹
BYCHIPS是 M30R334K1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的M30R334K1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 100V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | - |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.300" L x 0.200" W (7.62mm x 5.08mm) |
| 系列: | M30 |
| 評級: | - |
| 封装: | Bulk |
| 封裝/箱體: | Radial |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | M30R334K1 |
| 引線型: | Straight |
| 引線間距: | 0.200" (5.08mm) |
| 高度 - 座高（最大）: | 0.420" (10.66mm) |
| 特徵: | - |
| 失敗率: | - |
| 展開說明: | 0.33µF ±10% 100V Ceramic Capacitor X7R Radial |
| 描述: | CAP CER 0.33UF 100V X7R RADIAL |
| 電容: | 0.33µF |
| 應用: | General Purpose |
| Email: | [email protected] |
M30R334K1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
M30R334K5-F | Cornell Dubilier Electronics (CDE) | CAP CER 0.33UF 50V X7R RADIAL | 在線詢價 |
 |
6LS102SAHCK | AVX Corporation | CAP CER 1000PF 2KV Y5P RADIAL | 在線詢價 |
 |
0805Y5000270KQT | Knowles Syfer | CAP CER HIGH Q 0805 | 在線詢價 |
|
M30R334M5 | Cornell Dubilier Electronics (CDE) | CAP CER 0.33UF 50V X7R RADIAL | 在線詢價 |
|
1206Y0630821FAR | Knowles Syfer | CAP CER 1206 | 在線詢價 |
 |
CGA4J3X5R1H684M125AB | TDK Corporation | CAP CER 0.68UF 50V X5R 0805 | 在線詢價 |
|
1206Y1000562GAR | Knowles Syfer | CAP CER 1206 | 在線詢價 |
|
1210J1000391GAT | Knowles Syfer | CAP CER 1210 | 在線詢價 |
 |
GCJ21BR71C475KA01L | Murata Electronics North America | CAP CER 4.7UF 16V X7R 0805 | 在線詢價 |
|
1808J5000562MDT | Knowles Syfer | CAP CER 5600PF 500V X7R 1808 | 在線詢價 |
|
1825Y1K20102FCR | Knowles Syfer | CAP CER 1825 | 在線詢價 |
 |
C410C682G5G5TA | KEMET | CAP CER 6800PF 50V C0G AXIAL | 在線詢價 |
|
C420C681K2G5TA7200 | KEMET | CAP CER 680PF 200V C0G AXIAL | 在線詢價 |
|
2225Y3K00121KCR | Knowles Syfer | CAP CER 2225 | 在線詢價 |
|
1210Y0630273JCT | Knowles Syfer | CAP CER 1210 | 在線詢價 |
|
1111J3000510KQT | Knowles Syfer | CAP CER 51PF 300V C0G/NP0 1111 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers