購買 LSF0102DQER與BYCHPS
購買即有保證
LSF0102DQER
- 型號:
- LSF0102DQER
- 製造商:
- 描述:
- IC LEVEL TRANSLATOR BIDIR 8SON
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13572 Pieces
- 數據表:
- LSF0102DQER.pdf
簡單介紹
BYCHIPS是 LSF0102DQER的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的LSF0102DQER購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - VCCB: | 1.8 V ~ 5.5 V |
|---|---|
| 電壓 - VCCA: | 0.95 V ~ 4.5 V |
| 翻譯類型: | Voltage Level |
| 供應商設備封裝: | 8-X2SON (1.4x1.0) |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-XFDFN |
| 輸出類型: | Open Drain, Push-Pull |
| 輸出信號: | - |
| 其他名稱: | 296-40399-2 LSF0102DQER-ND |
| 工作溫度: | -40°C ~ 125°C (TA) |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | LSF0102DQER |
| 輸入信號: | - |
| 特徵: | Auto-Direction Sensing |
| 展開說明: | Voltage Level Translator Bidirectional 1 Circuit 2 Channel 8-X2SON (1.4x1.0) |
| 描述: | IC LEVEL TRANSLATOR BIDIR 8SON |
| 數據速率: | - |
| 每路電路: | 2 |
| 基射極飽和電壓（最大值）: | Bidirectional |
| Email: | [email protected] |
LSF0102DQER的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
LSF0108QPWRQ1 | Texas Instruments | IC 8CH LEVEL TRANS BIDIR | 在線詢價 |
|
LSF0101DRYR | Texas Instruments | IC TRANSLATOR BIDIR 6SON | 在線詢價 |
|
LSF0102DCUR | Texas Instruments | IC LEVEL TRANSLATOR BIDIR US8 | 在線詢價 |
|
LSF0108RKSR | Texas Instruments | IC 8CH LEVEL TRANS BIDIR 20VQFN | 在線詢價 |
|
LSF0102YZTR | Texas Instruments | IC LEVEL TRANSLATOR BIDIR 8BGA | 在線詢價 |
|
LSF0102DCTR | Texas Instruments | IC LEVEL TRANSLATOR BIDIR 8SM | 在線詢價 |
|
LSF0108PWR | Texas Instruments | IC 8CH LEVEL TRANS BIDIR 20TSSOP | 在線詢價 |
 |
IDT74LVC4245APYG8 | IDT, Integrated Device Technology Inc | IC BUS TRANSCVR 3-ST 8BIT 24SSOP | 在線詢價 |
|
74GTLPH16927GRE4 | Texas Instruments | IC 18BIT BUS TXRX 56-TSSOP | 在線詢價 |
 |
74LVC4245APW,112 | Nexperia USA Inc. | IC TRANSCVR TRI-ST DL 24TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers