購買 LF3J3PAK與BYCHPS
購買即有保證
LF3J3PAK
- 型號:
- LF3J3PAK
- 製造商:
- Littelfuse
- 描述:
- FUSE CLIP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17022 Pieces
- 數據表:
- LF3J3PAK.pdf
簡單介紹
BYCHIPS是 LF3J3PAK的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的LF3J3PAK購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 系列: | * |
|---|---|
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 11 Weeks |
| 製造商零件編號: | LF3J3PAK |
| 描述: | FUSE CLIP |
| Email: | [email protected] |
LF3J3PAK的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
0853.0576 | Schurter Inc. | COVER REFLOW W/CLAMP PCB 5X20MM | 在線詢價 |
 |
2905584 | Phoenix Contact | SPARK GAP | 在線詢價 |
 |
4400.042 | Schurter Inc. | KNURLED NUT CIRCUIT BRKR NICKEL | 在線詢價 |
 |
913-774 | Littelfuse Inc. | ISO/MINI TERMINAL/ 3.32 5 | 在線詢價 |
 |
2A1630-10 | Eaton | MAIN DEVICE SUB ASSY 200A | 在線詢價 |
|
0913774001 | Littelfuse Inc. | ISO MINI TERMINAL 3.32-5.37M | 在線詢價 |
|
J-13 | Eaton | FUSE REDUCER | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers