購買 KS-2R8334-R與BYCHPS
購買即有保證
KS-2R8334-R
- 型號:
- KS-2R8334-R
- 製造商:
- Bussmann (Eaton)
- 描述:
- CAP 330MF -20% +80% 2.8V SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18219 Pieces
- 數據表:
- KS-2R8334-R.pdf
簡單介紹
BYCHIPS是 KS-2R8334-R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的KS-2R8334-R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2.8V |
|---|---|
| 公差: | -20%, +80% |
| 終止: | Solder Tabs |
| 尺寸/尺寸: | 0.268" Dia (6.80mm) |
| 系列: | PowerStor KS |
| 封装: | Bulk |
| 封裝/箱體: | Coin, Thin Terminals - Same Sides |
| 其他名稱: | 283-2862 KS-2R8-334-R KS2R8334R |
| 工作溫度: | -25°C ~ 70°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | KS-2R8334-R |
| 壽命@溫度。: | 1000 Hrs @ 70°C |
| 引線間距: | - |
| 高度 - 座高（最大）: | 0.110" (2.80mm) |
| 展開說明: | 330mF -20%, +80%(EDLC) Supercapacitor 2.8V Coin, Thin Terminals - Same Sides 100 Ohm @ 1kHz 1000 Hrs @ 70°C |
| ESR（等效串聯電阻）: | 100 Ohm @ 1kHz |
| 描述: | CAP 330MF -20% +80% 2.8V SMD |
| 電容: | 330mF |
| Email: | [email protected] |
KS-2R8334-R的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
KS-3R3224-R | Eaton | CAP 220MF -20% +80% 3.3V SMD | 在線詢價 |
 |
BZ023A284ZAB | AVX Corporation | CAP 280MF -20% +80% 3.6V T/H | 在線詢價 |
 |
KSR-2R8334-R | Eaton | CAP 330MF -20% +80% 2.8V SMD | 在線詢價 |
 |
KSL-3R3703E-R | Eaton | CAP 70MF -20% +80% 3.3V SMD | 在線詢價 |
 |
KR-5R5V224-R | Eaton | CAP 220MF -20% +80% 5.5V T/H | 在線詢價 |
 |
DS-2R5H224U-HL | Elna America | CAP 220MF -20% +80% 2.5V SMD | 在線詢價 |
|
KSR-3R3204-R | Eaton | CAP 200MF -20% +80% 3.3V SMD | 在線詢價 |
 |
PAS311HR-VG1 | Taiyo Yuden | CAP 30MF 3.3V SURFACE MOUNT | 在線詢價 |
 |
KSL-3R3703S-R | Eaton | CAP 70MF -20% +80% 3.3V SMD | 在線詢價 |
 |
DZ-2R5D105T | Elna America | CAP 1F -20% +80% 2.5V T/H | 在線詢價 |
 |
DMF4B5R5G105M3DTA0 | Murata Electronics North America | CAP SUPER 1F 5.5V 3-SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers