購買 IXSR50N60B與BYCHPS
購買即有保證
IXSR50N60B
- 型號:
- IXSR50N60B
- 製造商:
- IXYS Corporation
- 描述:
- IGBT 600V ISOPLUS247
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12199 Pieces
- 數據表:
- IXSR50N60B.pdf
簡單介紹
BYCHIPS是 IXSR50N60B的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IXSR50N60B購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | - |
| 測試條件: | - |
| Td（開/關）@ 25°C: | - |
| 開關能量: | - |
| 供應商設備封裝: | ISOPLUS247™ |
| 系列: | - |
| 功率 - 最大: | - |
| 封装: | Tube |
| 封裝/箱體: | ISOPLUS247™ |
| 工作溫度: | - |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | IXSR50N60B |
| 輸入類型: | Standard |
| IGBT類型: | - |
| 展開說明: | IGBT 600V Through Hole ISOPLUS247™ |
| 描述: | IGBT 600V ISOPLUS247 |
| 電流 - 集電極脈衝（ICM）: | - |
| 電流 - 集電極（Ic）（最大）: | - |
| Email: | [email protected] |
IXSR50N60B的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IXGH30N120IH | IXYS | IGBT 1200V 50A TO-247 | 在線詢價 |
 |
IRG4PH40UDPBF | Infineon Technologies | IGBT 1200V 41A 160W TO247AC | 在線詢價 |
 |
IXSR50N60BU1 | IXYS | IGBT 600V ISOPLUS247 | 在線詢價 |
 |
IXYP30N120C3 | IXYS | IGBT 1200V 75A 500W TO220 | 在線詢價 |
 |
NGTB60N65FL2WG | ON Semiconductor | 650V/60A IGBT FSII | 在線詢價 |
 |
IHW40N60RF | Infineon Technologies | IGBT 600V 80A 305W TO247-3 | 在線詢價 |
|
IXGH20N100 | IXYS | IGBT 1000V 40A 150W TO247 | 在線詢價 |
 |
IXXK160N65B4 | IXYS | IGBT 650V 310A 940W TO264 | 在線詢價 |
 |
AOT15B65M1 | Alpha & Omega Semiconductor Inc. | IGBT 650V 15A TO220 | 在線詢價 |
 |
FGH30T65UPDT_F155 | Fairchild/ON Semiconductor | IGBT 650V 60A 250W TO247-3 | 在線詢價 |
 |
IRG6S330UPBF | Infineon Technologies | IGBT 330V 70A 160W D2PAK | 在線詢價 |
 |
IXGA12N60BD1 | IXYS | IGBT 600V 24A 100W TO263AA | 在線詢價 |
 |
IXDH30N120 | IXYS | IGBT 1200V 60A 300W TO247AD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers