購買 IXFH12N120P與BYCHPS
購買即有保證
IXFH12N120P
- 型號:
- IXFH12N120P
- 製造商:
- IXYS Corporation
- 描述:
- MOSFET N-CH 1200V 12A TO-247
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13332 Pieces
- 數據表:
- IXFH12N120P.pdf
簡單介紹
BYCHIPS是 IXFH12N120P的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IXFH12N120P購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 6.5V @ 1mA |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | TO-247AD (IXFH) |
| 系列: | HiPerFET™, PolarP2™ |
| RDS（ON）（最大值）@標識，柵極電壓: | 1.35 Ohm @ 500mA, 10V |
| 功率耗散（最大）: | 543W (Tc) |
| 封装: | Tube |
| 封裝/箱體: | TO-247-3 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | IXFH12N120P |
| 輸入電容（Ciss）（Max）@ Vds: | 5400pF @ 25V |
| 柵極電荷（Qg）（Max）@ Vgs: | 103nC @ 10V |
| FET型: | N-Channel |
| FET特點: | - |
| 展開說明: | N-Channel 1200V (1.2kV) 12A (Tc) 543W (Tc) Through Hole TO-247AD (IXFH) |
| 漏極至源極電壓（Vdss）: | 1200V (1.2kV) |
| 描述: | MOSFET N-CH 1200V 12A TO-247 |
| 電流 - 25°C連續排水（Id）: | 12A (Tc) |
| Email: | [email protected] |
IXFH12N120P的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IXFH12N120 | IXYS | MOSFET N-CH 1200V 12A TO-247 | 在線詢價 |
|
IXFH120N15P | IXYS | MOSFET N-CH 150V 120A TO-247 | 在線詢價 |
|
IXFH12N80P | IXYS | MOSFET N-CH 800V 12A TO-247 | 在線詢價 |
|
IXFH12N100F | IXYS | MOSFET N-CH 1000V 12A TO-247AD | 在線詢價 |
|
IXFH12N90 | IXYS | MOSFET N-CH 900V 12A TO-247AD | 在線詢價 |
|
IXFH102N15T | IXYS | MOSFET N-CH 150V 102A TO-247 | 在線詢價 |
|
IXFH12N100 | IXYS | MOSFET N-CH 1KV 12A TO-247AD | 在線詢價 |
|
IXFH12N100Q | IXYS | MOSFET N-CH 1000V 12A TO-247AD | 在線詢價 |
|
IXFH12N100P | IXYS | MOSFET N-CH 1000V 12A TO-247 | 在線詢價 |
|
IXFH120N25T | IXYS | MOSFET N-CH 250V 120A TO-247 | 在線詢價 |
|
IXFH12N90P | IXYS | MOSFET N-CH 900V 12A TO-247 | 在線詢價 |
|
IXFH12N50F | IXYS | MOSFET N-CH 500V 12A TO247 | 在線詢價 |
|
IXFH120N20P | IXYS | MOSFET N-CH 200V 120A TO-247 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers