購買 ISL91127II2AZ-T7A與BYCHPS
購買即有保證
ISL91127II2AZ-T7A
- 型號:
- ISL91127II2AZ-T7A
- 製造商:
- Intersil
- 描述:
- IC REG BUCK BST 2.1A WLCSP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13071 Pieces
簡單介紹
BYCHIPS是 ISL91127II2AZ-T7A的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ISL91127II2AZ-T7A購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 輸出（最小/固定）: | - |
|---|---|
| 電壓 - 輸出（最大）: | - |
| 電壓 - 輸入（最小值）: | 1.8V |
| 電壓 - 輸入（最大）: | 5.5V |
| 拓撲: | Buck-Boost |
| 同步整流: | Yes |
| 供應商設備封裝: | 20-WLCSP |
| 系列: | - |
| 封装: | Original-Reel® |
| 封裝/箱體: | 20-XFBGA, WLCSP |
| 輸出類型: | - |
| 輸出配置: | Positive |
| 其他名稱: | ISL91127II2AZ-T7ADKR |
| 工作溫度: | - |
| 輸出端數量: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 5 Weeks |
| 製造商零件編號: | ISL91127II2AZ-T7A |
| 功能: | Step-Up/Step-Down |
| 頻率 - 開關: | 2.5MHz |
| 展開說明: | Buck-Boost Switching Regulator IC Positive 1 Output 2.1A 20-XFBGA, WLCSP |
| 描述: | IC REG BUCK BST 2.1A WLCSP |
| 電流 - 輸出: | 2.1A |
| Email: | [email protected] |
ISL91127II2AZ-T7A的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
ISL91127II2AZ-T | Intersil | IC REG BUCK BST 2.1A WLCSP | 在線詢價 |
 |
ISL91127IRNZ-T7A | Intersil | IC REG BUCK BST 3.3V 2A WLCSP | 在線詢價 |
|
ISL91127IIAZ-T7A | Intersil | IC REG BUCK BST 2.1A WLCSP | 在線詢價 |
|
ISL91127IRAZ-T | Intersil | HIGH EFFICIENCY BUCK/BOOSTREGULA | 在線詢價 |
|
ISL91127IIAZ-T | Intersil | IC REG BUCK BST 2.1A WLCSP | 在線詢價 |
|
ISL91127IINZ-T | Intersil | IC REG BUCK BST 3.3V 2.1A WLCSP | 在線詢價 |
|
ISL91127IINZ-T7A | Intersil | IC REG BUCK BST 3.3V 2.1A WLCSP | 在線詢價 |
|
ISL91128IINZ-T7A | Intersil | HIGH CURRENT BUCK BOOST WITH I2C | 在線詢價 |
 |
ISL9112IRT7Z-T7A | Intersil | IC REG BUCK BOOST 5V 1.2A 12TDFN | 在線詢價 |
|
ISL91127IRAZ-T7A | Intersil | IC REG BUCK BST ADJ 2A WLCSP | 在線詢價 |
|
ISL91127IRNZ-T | Intersil | HIGH EFFICIENCY BUCK/BOOSTREGULA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers