購買 IRGPS40B120UPBF與BYCHPS
購買即有保證
IRGPS40B120UPBF
- 型號:
- IRGPS40B120UPBF
- 描述:
- IGBT 1200V 80A 595W SUPER247
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15242 Pieces
簡單介紹
BYCHIPS是 IRGPS40B120UPBF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IRGPS40B120UPBF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 1200V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 3.71V @ 15V, 50A |
| 測試條件: | 600V, 40A, 4.7 Ohm, 15V |
| Td（開/關）@ 25°C: | - |
| 開關能量: | 1.4mJ (on), 1.65mJ (off) |
| 供應商設備封裝: | SUPER-247 (TO-274AA) |
| 系列: | - |
| 功率 - 最大: | 595W |
| 封装: | Bulk |
| 封裝/箱體: | TO-274AA |
| 其他名稱: | *IRGPS40B120UPBF SP001540742 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 13 Weeks |
| 製造商零件編號: | IRGPS40B120UPBF |
| 輸入類型: | Standard |
| IGBT類型: | NPT |
| 柵極電荷: | 340nC |
| 展開說明: | IGBT NPT 1200V 80A 595W Through Hole SUPER-247 (TO-274AA) |
| 描述: | IGBT 1200V 80A 595W SUPER247 |
| 電流 - 集電極脈衝（ICM）: | 160A |
| 電流 - 集電極（Ic）（最大）: | 80A |
| Email: | [email protected] |
IRGPS40B120UPBF的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SGR6N60UFTM | Fairchild/ON Semiconductor | IGBT 600V 6A 30W DPAK | 在線詢價 |
 |
IRGPS46160DPBF | Infineon Technologies | IGBT 600V 240A 750W SUPER247 | 在線詢價 |
 |
IRGPS66160DPBF | Infineon Technologies | IGBT 600V 160A TO247 | 在線詢價 |
 |
FGAF40N60UFDTU | Fairchild/ON Semiconductor | IGBT 600V 40A 100W TO3PF | 在線詢價 |
 |
STGP19NC60S | STMicroelectronics | IGBT 600V 40A 130W TO220 | 在線詢價 |
|
IRGPS40B120UDP | Infineon Technologies | IGBT 1200V 80A 595W SUPER247 | 在線詢價 |
|
IRGPS47160DPBF | Infineon Technologies | IGBT 600V TO247 COPAK | 在線詢價 |
 |
IRGPS60B120KDP | Infineon Technologies | IGBT 1200V 105A 595W SUPER247 | 在線詢價 |
|
AUIRGP76524D0 | Infineon Technologies | DIODE IGBT 680V 24A TO-247AC | 在線詢價 |
 |
RJH60F5BDPQ-A0#T0 | Renesas Electronics America | IGBT 600V 80A 260.4W TO-247A | 在線詢價 |
|
IRGPS4067DPBF | Infineon Technologies | IGBT 600V 240A 750W SUPER-247 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers