購買 IRG4PSC71K與BYCHPS
購買即有保證
IRG4PSC71K
- 型號:
- IRG4PSC71K
- 描述:
- IGBT 600V 85A 350W SUPER247
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 18805 Pieces
- 數據表:
- IRG4PSC71K.pdf
簡單介紹
BYCHIPS是 IRG4PSC71K的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IRG4PSC71K購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.3V @ 15V, 60A |
| 測試條件: | 480V, 60A, 5 Ohm, 15V |
| Td（開/關）@ 25°C: | 34ns/54ns |
| 開關能量: | 790µJ (on), 1.98mJ (off) |
| 供應商設備封裝: | SUPER-247 (TO-274AA) |
| 系列: | - |
| 功率 - 最大: | 350W |
| 封装: | Bulk |
| 封裝/箱體: | TO-274AA |
| 其他名稱: | *IRG4PSC71K Q978708 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | IRG4PSC71K |
| 輸入類型: | Standard |
| IGBT類型: | - |
| 柵極電荷: | 340nC |
| 展開說明: | IGBT 600V 85A 350W Through Hole SUPER-247 (TO-274AA) |
| 描述: | IGBT 600V 85A 350W SUPER247 |
| 電流 - 集電極脈衝（ICM）: | 200A |
| 電流 - 集電極（Ic）（最大）: | 85A |
| Email: | [email protected] |
IRG4PSC71K的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IRG4PH20K | Infineon Technologies | IGBT 1200V 11A 60W TO247AC | 在線詢價 |
 |
IRG4PSC71KPBF | Infineon Technologies | IGBT 600V 85A 350W SUPER247 | 在線詢價 |
|
IRG4PSC71UDPBF | Infineon Technologies | IGBT 600V 85A 350W SUPER247 | 在線詢價 |
 |
IRGP4262D-EPBF | Infineon Technologies | IGBT 650V 60A 250W TO247AC | 在線詢價 |
|
IRG4PSC71UPBF | Infineon Technologies | IGBT 600V 85A 350W SUPER247 | 在線詢價 |
|
IRG4PSC71KD | Infineon Technologies | IGBT 600V 85A 350W SUPER247 | 在線詢價 |
|
IRG4PSC71KDPBF | Infineon Technologies | IGBT 600V 85A 350W SUPER247 | 在線詢價 |
 |
APT65GP60L2DQ2G | Microsemi Corporation | IGBT 600V 198A 833W TO264 | 在線詢價 |
 |
AOK50B65M2 | Alpha & Omega Semiconductor Inc. | IGBT 650V 50A TO247 | 在線詢價 |
 |
NGTB40N120IHRWG | ON Semiconductor | IGBT 1200V 80A 384W TO247 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers