購買 IRF3315STRR與BYCHPS
購買即有保證
IRF3315STRR
- 型號:
- IRF3315STRR
- 描述:
- MOSFET N-CH 150V 21A D2PAK
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 15629 Pieces
- 數據表:
- IRF3315STRR.pdf
簡單介紹
BYCHIPS是 IRF3315STRR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IRF3315STRR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 4V @ 250µA |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | D2PAK |
| 系列: | HEXFET® |
| RDS（ON）（最大值）@標識，柵極電壓: | 82 mOhm @ 12A, 10V |
| 功率耗散（最大）: | 3.8W (Ta), 94W (Tc) |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| 工作溫度: | -55°C ~ 175°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | IRF3315STRR |
| 輸入電容（Ciss）（Max）@ Vds: | 1300pF @ 25V |
| 柵極電荷（Qg）（Max）@ Vgs: | 95nC @ 10V |
| FET型: | N-Channel |
| FET特點: | - |
| 展開說明: | N-Channel 150V 21A (Tc) 3.8W (Ta), 94W (Tc) Surface Mount D2PAK |
| 漏極至源極電壓（Vdss）: | 150V |
| 描述: | MOSFET N-CH 150V 21A D2PAK |
| 電流 - 25°C連續排水（Id）: | 21A (Tc) |
| Email: | [email protected] |
IRF3315STRR的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IRF3315S | Infineon Technologies | MOSFET N-CH 150V 21A D2PAK | 在線詢價 |
 |
IRF3315LPBF | Infineon Technologies | MOSFET N-CH 150V 21A TO-262 | 在線詢價 |
|
IRF3315STRLPBF | Infineon Technologies | MOSFET N-CH 150V 21A D2PAK | 在線詢價 |
|
IRF3315STRRPBF | Infineon Technologies | MOSFET N-CH 150V 21A D2PAK | 在線詢價 |
 |
IRF3315 | Infineon Technologies | MOSFET N-CH 150V 27A TO-220AB | 在線詢價 |
|
IRF3315L | Infineon Technologies | MOSFET N-CH 150V 21A TO-262 | 在線詢價 |
|
IRF3305 | Infineon Technologies | MOSFET N-CH 55V 75A TO-220AB | 在線詢價 |
|
IRF3315PBF | Infineon Technologies | MOSFET N-CH 150V 23A TO-220AB | 在線詢價 |
|
IRF3315SPBF | Infineon Technologies | MOSFET N-CH 150V 21A D2PAK | 在線詢價 |
|
IRF3315STRL | Infineon Technologies | MOSFET N-CH 150V 21A D2PAK | 在線詢價 |
|
IRF3314STRR | Infineon Technologies | MOSFET N-CH 150V D2PAK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers