購買 IPD60R380E6ATMA2與BYCHPS
購買即有保證
IPD60R380E6ATMA2
- 型號:
- IPD60R380E6ATMA2
- 描述:
- MOSFET NCH 600V 10.6A TO252
- 無鉛狀態/ RoHS狀態:
- 不適用/不適用
- 庫存數量:
- 14278 Pieces
簡單介紹
BYCHIPS是 IPD60R380E6ATMA2的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IPD60R380E6ATMA2購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 3.5V @ 300µA |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | PG-TO252-3 |
| 系列: | CoolMOS™ |
| RDS（ON）（最大值）@標識，柵極電壓: | 380 mOhm @ 3.8A, 10V |
| 功率耗散（最大）: | 83W (Tc) |
| 封装: | Bulk |
| 封裝/箱體: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 製造商零件編號: | IPD60R380E6ATMA2 |
| 輸入電容（Ciss）（Max）@ Vds: | 700pF @ 100V |
| 柵極電荷（Qg）（Max）@ Vgs: | 32nC @ 10V |
| FET型: | N-Channel |
| FET特點: | Super Junction |
| 展開說明: | N-Channel 600V 10.6A (Tc) 83W (Tc) Surface Mount PG-TO252-3 |
| 漏極至源極電壓（Vdss）: | 600V |
| 描述: | MOSFET NCH 600V 10.6A TO252 |
| 電流 - 25°C連續排水（Id）: | 10.6A (Tc) |
| Email: | [email protected] |
IPD60R380E6ATMA2的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IPD60R380P6BTMA1 | Infineon Technologies | MOSFET N-CH 600V 3TO252 | 在線詢價 |
|
IPD60R385CPBTMA1 | Infineon Technologies | MOSFET N-CH 650V 9A TO-252 | 在線詢價 |
|
IPD60R380P6ATMA1 | Infineon Technologies | MOSFET N-CH 600V DPAK-3 | 在線詢價 |
|
IPD60R380C6ATMA1 | Infineon Technologies | MOSFET N-CH 600V 10.6A TO252 | 在線詢價 |
|
IPD60R380E6BTMA1 | Infineon Technologies | MOSFET NCH 600V 10.6A TO252 | 在線詢價 |
|
IPD60R380C6 | Infineon Technologies | MOSFET N-CH 600V 10.6A TO252 | 在線詢價 |
|
IPD60R3K3C6ATMA1 | Infineon Technologies | MOSFET N-CH 600V 1.7A TO252-3 | 在線詢價 |
|
IPD60R385CPATMA1 | Infineon Technologies | MOSFET N-CH 600V 9A TO-252 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers