購買 IHLD4032KBER330M5A與BYCHPS
購買即有保證
IHLD4032KBER330M5A
- 型號:
- IHLD4032KBER330M5A
- 製造商:
- Dale / Vishay
- 描述:
- FIXED IND 33UH 3.8A 107 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17013 Pieces
簡單介紹
BYCHIPS是 IHLD4032KBER330M5A的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IHLD4032KBER330M5A購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | - |
|---|---|
| 公差: | ±20% |
| 尺寸/尺寸: | 0.469" L x 0.379" W (11.90mm x 9.62mm) |
| 屏蔽: | Shielded |
| 系列: | IHLD-5A |
| 評級: | AEC-Q200 |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 541-2934-2 |
| 工作溫度: | -55°C ~ 155°C |
| 安裝類型: | Surface Mount |
| 材料 - 核: | - |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | IHLD4032KBER330M5A |
| 電感: | 33µH |
| 高度 - 座高（最大）: | 0.441" (11.20mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | 6MHz |
| 展開說明: | 33µH Shielded Inductor 3.8A 107 mOhm Max Nonstandard |
| 描述: | FIXED IND 33UH 3.8A 107 MOHM |
| 直流電阻（DCR）: | 107 mOhm Max |
| 目前評級: | 3.8A |
| 電流 - 飽和: | 3.7A |
| Email: | [email protected] |
IHLD4032KBER330M5A的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IHLD4032KBER100M5A | Vishay Dale | FIXED IND 10UH 5.6A 32.6 MOHM | 在線詢價 |
 |
B82145A1684J | EPCOS (TDK) | FIXED IND 680UH 440MA 2.5 OHM TH | 在線詢價 |
|
IHLD4032KBER220M5A | Vishay Dale | FIXED IND 22UH 4.1A 72.5 MOHM | 在線詢價 |
|
IHLD4032KBER150M5A | Vishay Dale | FIXED IND 15UH 4.6A 45.5 MOHM | 在線詢價 |
 |
RL187-122J-RC | Bourns Inc. | FIXED IND 1.2MH 150MA 9 OHM TH | 在線詢價 |
 |
LQG15HH9N1H02D | Murata Electronics North America | FIXED IND 9.1NH 500MA 260 MOHM | 在線詢價 |
 |
VLF3010AT-4R7MR70 | TDK Corporation | FIXED IND 4.7UH 700MA 280 MOHM | 在線詢價 |
 |
MLP2520S4R7MT0S1 | TDK Corporation | FIXED IND 4.7UH 1A 130 MOHM SMD | 在線詢價 |
 |
2256R-06L | API Delevan Inc. | FIXED IND 2.7UH 3.41A 34 MOHM TH | 在線詢價 |
 |
ELJ-RG8N2JF | Panasonic Electronic Components | FIXED IND 8.2NH 230MA 1 OHM SMD | 在線詢價 |
 |
SRU8045A-220Y | Bourns Inc. | FIXED IND 22UH 2.25A 122 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers