購買 IFLR5151HZERR44M01與BYCHPS
購買即有保證
IFLR5151HZERR44M01
- 型號:
- IFLR5151HZERR44M01
- 製造商:
- Dale / Vishay
- 描述:
- FIXED IND 440NH 50A 0.35 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15457 Pieces
簡單介紹
BYCHIPS是 IFLR5151HZERR44M01的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IFLR5151HZERR44M01購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | - |
|---|---|
| 公差: | ±20% |
| 尺寸/尺寸: | 0.512" L x 0.512" W (13.00mm x 13.00mm) |
| 屏蔽: | Shielded |
| 系列: | IFLR-5151HZ-01 |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 2-SMD, J-Lead |
| 其他名稱: | 541-3116-2 |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | - |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | IFLR5151HZERR44M01 |
| 電感: | 440nH |
| 高度 - 座高（最大）: | 0.315" (8.00mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | - |
| 展開說明: | 440nH Shielded Inductor 50A 0.35 mOhm Max 2-SMD, J-Lead |
| 描述: | FIXED IND 440NH 50A 0.35 MOHM |
| 直流電阻（DCR）: | 0.35 mOhm Max |
| 目前評級: | 50A |
| 電流 - 飽和: | 35A |
| Email: | [email protected] |
IFLR5151HZERR44M01的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
ELJ-PA121KF | Panasonic Electronic Components | FIXED IND 120UH 75MA 7 OHM SMD | 在線詢價 |
 |
IFLR5151HZERR32M01 | Vishay Dale | FIXED IND 320NH 50A 0.35 MOHM | 在線詢價 |
 |
LB2012T4R7MV | Taiyo Yuden | FIXED IND 4.7UH 190MA 400 MOHM | 在線詢價 |
 |
5022-154G | API Delevan Inc. | FIXED IND 150UH 237MA 6.05 OHM | 在線詢價 |
 |
SC53FU-331 | Signal Transformer | FIXED IND 330UH 250MA 4.3 OHM | 在線詢價 |
|
IFLR5151HZERR26M01 | Vishay Dale | FIXED IND 260NH 50A 0.35 MOHM | 在線詢價 |
 |
74404041010 | Wurth Electronics Inc. | FIXED IND 1UH 2.52A 41 MOHM SMD | 在線詢價 |
 |
PM5022S-151M-RC | Bourns Inc. | FIXED IND 150UH 1.05A 400 MOHM | 在線詢價 |
|
IFLR5151HZERR21M01 | Vishay Dale | FIXED IND 210NH 50A 0.35 MOHM | 在線詢價 |
 |
MLG1005S13NHT000 | TDK Corporation | FIXED IND 13NH 400MA 500 MOHM | 在線詢價 |
 |
DD1274AS-H-2R2N=P3 | Murata Electronics North America | FIXED IND 2.2UH 8A 9.6 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers