購買 IDT74LVC16344APAG8與BYCHPS
購買即有保證
IDT74LVC16344APAG8
- 型號:
- IDT74LVC16344APAG8
- 描述:
- IC CLK BUFFER 2:4 56TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16399 Pieces
簡單介紹
BYCHIPS是 IDT74LVC16344APAG8的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IDT74LVC16344APAG8購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.3 V ~ 3.6 V |
|---|---|
| 類型: | Fanout Buffer (Distribution) |
| 供應商設備封裝: | 56-TSSOP |
| 系列: | 74LVC |
| 比率 - 輸入：輸出: | 2:4 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 56-TFSOP (0.240", 6.10mm Width) |
| 產量: | 3-State |
| 其他名稱: | 74LVC16344APAG8 |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | IDT74LVC16344APAG8 |
| 輸入: | Clock |
| 頻率 - 最大: | - |
| 展開說明: | Clock Fanout Buffer (Distribution) IC 56-TFSOP (0.240", 6.10mm Width) |
| 差分 - 輸入：輸出: | No/No |
| 描述: | IC CLK BUFFER 2:4 56TSSOP |
| Email: | [email protected] |
IDT74LVC16344APAG8的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IDT74LVC16344APVG8 | IDT, Integrated Device Technology Inc | IC CLK BUFFER 2:4 56-SSOP | 在線詢價 |
 |
IDT74FCT374ATSO | IDT, Integrated Device Technology Inc | IC D-TYPE POS TRG SNGL 20SOIC | 在線詢價 |
|
IDT74LVC16344APAG | IDT, Integrated Device Technology Inc | IC CLK BUFFER 2:4 56TSSOP | 在線詢價 |
|
IDT74FCT20807PYI8 | IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:10 166MHZ 20SSOP | 在線詢價 |
|
IDT74LVC16823APAG8 | IDT, Integrated Device Technology Inc | IC D-TYPE POS TRG DUAL 56TSSOP | 在線詢價 |
|
IDT74SSTU32864ABFG | IDT, Integrated Device Technology Inc | IC BUFFER 1:1/1:2 96-LFBGA | 在線詢價 |
|
IDT74LVC16501APAG | IDT, Integrated Device Technology Inc | IC TRSCVR TRI-ST 18BIT 56TSSOP | 在線詢價 |
|
IDT74FCT3807EQI8 | IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:10 166MHZ 20QSOP | 在線詢價 |
|
IDT74SSTU32864DBFG | IDT, Integrated Device Technology Inc | IC BUFFER 1:1/1:2 96-LFBGA | 在線詢價 |
|
IDT74FCT20807QI8 | IDT, Integrated Device Technology Inc | IC CLK BUFFER 1:10 166MHZ 20QSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers