購買 IC1206B221R-10與BYCHPS
購買即有保證
IC1206B221R-10
- 型號:
- IC1206B221R-10
- 描述:
- FIXED INDUCT 220NH
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13803 Pieces
簡單介紹
BYCHIPS是 IC1206B221R-10的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的IC1206B221R-10購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | - |
|---|---|
| 公差: | ±10% |
| 尺寸/尺寸: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| 屏蔽: | Unshielded |
| 系列: | IC |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1206 (3216 Metric) |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | IC1206B221R-10 |
| 電感: | 220nH |
| 高度 - 座高（最大）: | 0.055" (1.40mm) |
| 頻率 - 自諧振: | - |
| 展開說明: | 220nH Unshielded Inductor 1206 (3216 Metric) |
| 描述: | FIXED INDUCT 220NH |
| 直流電阻（DCR）: | - |
| 目前評級: | - |
| 電流 - 飽和: | - |
| Email: | [email protected] |
IC1206B221R-10的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
36501E12NJTDG | TE Connectivity Passive Product | FIXED IND 12NH 640MA 120 MOHM | 在線詢價 |
 |
IC1206A332R-10 | Laird-Signal Integrity Products | FIXED INDUCT 3.33UH 50MA 700 MOH | 在線詢價 |
|
IC1206A472R-10 | Laird-Signal Integrity Products | FIXED INDUCT 4.7UH 50MA 900 MOHM | 在線詢價 |
|
IC1206A333R-10 | Laird-Signal Integrity Products | FIXED INDUCT 33UH 5MA 1.05 OHM | 在線詢價 |
|
IC1206A103R-10 | Laird-Signal Integrity Products | FIXED INDUCT 10UH 25MA 1 OHM | 在線詢價 |
|
IC1206B821R-10 | Laird-Signal Integrity Products | FIXED INDUCT 820NH 150MA 900 MOH | 在線詢價 |
|
IC1206B331R-10 | Laird-Signal Integrity Products | FIXED INDUCT 330NH 250MA 500 MOH | 在線詢價 |
|
IC1206B153R-10 | Laird-Signal Integrity Products | FIXED INDUCT 15UH 5MA 700 MOHM | 在線詢價 |
 |
SRR7045-681M | Bourns Inc. | FIXED IND 680UH 270MA 1.6 OHM | 在線詢價 |
 |
3443-48K | API Delevan Inc. | FIXED IND 100UH 3.3A 140 MOHM TH | 在線詢價 |
 |
LGJ7045TC-100M-D | TDK Corporation | FIXED IND 10UH 2.5A 38 MOHM SMD | 在線詢價 |
|
IC1206B183R-10 | Laird-Signal Integrity Products | FIXED INDUCT 18UH 5MA 700 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers