購買 HFW1130K07M與BYCHPS
購買即有保證
HFW1130K07M
- 型號:
- HFW1130K07M
- 描述:
- RELAY GEN PURPOSE DPDT 2A 26.5V
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17667 Pieces
- 數據表:
- HFW1130K07M.pdf
簡單介紹
BYCHIPS是 HFW1130K07M的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的HFW1130K07M購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 開啟電壓（最大值）: | 13.5 VDC |
|---|---|
| 關閉電壓（最小）: | 1.5 VDC |
| 端接類型: | Solder Hook |
| 切換電壓: | 28VDC - Nom |
| 系列: | Military, MIL-R-39016/6, HFW, CII |
| 繼電器類型: | General Purpose |
| 封装: | Bulk |
| 其他名稱: | 1-1617029-5 1122-1034 1122-1034-MIL A101588 A101588-ND M39016/6-204M |
| 工作溫度: | -65°C ~ 125°C |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 13 Weeks |
| 製造商零件編號: | HFW1130K07M |
| 特徵: | Sealed - Hermetically |
| 展開說明: | General Purpose Relay DPDT (2 Form C) Chassis Mount |
| 描述: | RELAY GEN PURPOSE DPDT 2A 26.5V |
| 觸點額定值（電流）: | 2A |
| 觸點材料: | - |
| 聯繫表: | DPDT (2 Form C) |
| 線圈電壓: | 26.5VDC |
| 線圈類型: | Non Latching |
| 線圈電阻: | - |
| 線圈功率: | - |
| 線圈電流: | 37.86mA |
| Email: | [email protected] |
HFW1130K07M的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
HFW1131K04M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1131K00 | TE Connectivity Aerospace, Defense and Marine | HFW1131K00 = HFW 1/2 SIZE RELA | 在線詢價 |
 |
HFW1131K04 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1130K06M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1131K05M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1106K12 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1131K04P | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1130K06P | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
 |
HFW1130K06 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers