購買 HD6417727BP100CV與BYCHPS
購買即有保證
HD6417727BP100CV
- 型號:
- HD6417727BP100CV
- 描述:
- IC MCU 32BIT ROMLESS 240LFBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12092 Pieces
簡單介紹
BYCHIPS是 HD6417727BP100CV的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的HD6417727BP100CV購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源（Vcc / VDD）: | 1.6 V ~ 2.05 V |
|---|---|
| 供應商設備封裝: | 240-LFBGA (13x13) |
| 速度: | 100MHz |
| 系列: | SuperH® SH7700 |
| RAM容量: | 32K x 8 |
| 程序存儲器類型: | ROMless |
| 程序存儲器大小: | - |
| 外設: | DMA, LCD, POR, WDT |
| 封装: | Tray |
| 封裝/箱體: | 240-LFBGA |
| 振盪器型: | Internal |
| 工作溫度: | -20°C ~ 75°C (TA) |
| I / O數量: | 104 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | HD6417727BP100CV |
| 展開說明: | SH-3 DSP SuperH® SH7700 Microcontroller IC 32-Bit 100MHz ROMless 240-LFBGA (13x13) |
| EEPROM容量: | - |
| 描述: | IC MCU 32BIT ROMLESS 240LFBGA |
| 數據轉換器: | A/D 6x10b; D/A 2x8b |
| 核心尺寸: | 32-Bit |
| 核心處理器: | SH-3 DSP |
| 連通性: | FIFO, SCI, SIO, SmartCard, USB |
| Email: | [email protected] |
HD6417727BP100CV的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
HD6417720BP133CV | Renesas Electronics America | IC MCU 32BIT ROMLESS 256LFBGA | 在線詢價 |
 |
HD6417729F133BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208LQFP | 在線詢價 |
|
HD6417760BL200AV | Renesas Electronics America | IC MCU 32BIT ROMLESS 256LFBGA | 在線詢價 |
|
HD6417712BPV | Renesas Electronics America | IC MCU 32BIT ROMLESS 256LFBGA | 在線詢價 |
 |
HD6417034AF20V | Renesas Electronics America | IC MCU 32BIT ROMLESS 112QFP | 在線詢價 |
 |
HD6417727BP160CV | Renesas Electronics America | IC MCU 32BIT ROMLESS 240LFBGA | 在線詢價 |
|
HD6417705F133BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208LQFP | 在線詢價 |
 |
HD6417708RF100AV | Renesas Electronics America | IC MCU 32BIT ROMLESS 144LQFP | 在線詢價 |
 |
HD6417709AF133BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208QFP | 在線詢價 |
 |
HD6417041AVF16V | Renesas Electronics America | IC MCU 32BIT ROMLESS 144QFP | 在線詢價 |
|
HD6417040ACF28V | Renesas Electronics America | IC MCU 32BIT ROMLESS 112QFP | 在線詢價 |
|
HD6417334F66BV | Renesas Electronics America | IC MCU 3V 0K PB FREE 208FP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers