購買 HBK331MBBTARKR與BYCHPS
購買即有保證
HBK331MBBTARKR
- 型號:
- HBK331MBBTARKR
- 描述:
- CAP CER 330PF 2KV RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17077 Pieces
簡單介紹
BYCHIPS是 HBK331MBBTARKR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的HBK331MBBTARKR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2000V (2kV) |
|---|---|
| 公差: | ±20% |
| 厚度（最大）: | - |
| 溫度係數: | - |
| 尺寸/尺寸: | 0.276" Dia (7.00mm) |
| 系列: | HBK |
| 評級: | - |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Disc |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 30 Weeks |
| 製造商零件編號: | HBK331MBBTARKR |
| 引線型: | Straight |
| 引線間距: | 0.295" (7.50mm) |
| 高度 - 座高（最大）: | 0.394" (10.00mm) |
| 特徵: | High Voltage |
| 失敗率: | - |
| 展開說明: | 330pF ±20% 2000V (2kV) Ceramic Capacitor Radial, Disc |
| 描述: | CAP CER 330PF 2KV RADIAL |
| 電容: | 330pF |
| 應用: | General Purpose |
| Email: | [email protected] |
HBK331MBBTARKR的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers