購買 HB4與BYCHPS
購買即有保證
簡單介紹
BYCHIPS是 HB4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的HB4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 產品規格: | Requires End Caps |
|---|---|
| 系列: | - |
| 其他名稱: | 338-3573 HB4-ND |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | HB4 |
| 適用於/相關產品: | Round Can Types |
| 設備大小: | 1.438" Dia x 3.375" L (36.5mm x 85.7mm) |
| 描述: | MOUNTING BRACKET FOR MOTOR START |
| 附件類型: | Mounting Bracket |
| Email: | [email protected] |
HB4的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
M8S17W25 | Cornell Dubilier Electronics (CDE) | INSULAT NUT FOR STUD MNT TYPES | 在線詢價 |
|
HB8 | Cornell Dubilier Electronics (CDE) | MOUNTING BRACKET FOR MOTOR START | 在線詢價 |
|
30434-73 | Cornell Dubilier Electronics (CDE) | AC/DC | 在線詢價 |
 |
H1 | KEMET | HARDWARE CAPACITOR CLIPS | 在線詢價 |
 |
HB2 | Cornell Dubilier Electronics (CDE) | MOUNTING BRACKET FOR MOTOR START | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers