購買 GTL16612DGG,118與BYCHPS
購買即有保證
GTL16612DGG,118
- 型號:
- GTL16612DGG,118
- 描述:
- IC TXRC UNVRSL 18BIT 3ST TSSOP56
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16351 Pieces
簡單介紹
BYCHIPS是 GTL16612DGG,118的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的GTL16612DGG,118購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - VCCB: | - |
|---|---|
| 電壓 - VCCA: | - |
| 翻譯類型: | Mixed Signal |
| 供應商設備封裝: | 56-TSSOP |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 56-TFSOP (0.240", 6.10mm Width) |
| 輸出類型: | Tri-State, Non-Inverted |
| 輸出信號: | LVTTL, TTL |
| 其他名稱: | 935264009118 GTL16612DG-T GTL16612DG-T-ND |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | GTL16612DGG,118 |
| 輸入信號: | GTL |
| 特徵: | - |
| 展開說明: | Mixed Signal Translator Bidirectional 1 Circuit 18 Channel 56-TSSOP |
| 描述: | IC TXRC UNVRSL 18BIT 3ST TSSOP56 |
| 數據速率: | - |
| 每路電路: | 18 |
| 基射極飽和電壓（最大值）: | Bidirectional |
| Email: | [email protected] |
GTL16612DGG,118的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SY89222LMI-TR | Microchip Technology | IC TRANSLATOR DUAL 3.3V 8-MLF | 在線詢價 |
 |
GTL16612DL,518 | NXP USA Inc. | IC TXRX UNVRSL 18BIT 3ST SSOP56 | 在線詢價 |
 |
MAX3397EELA+T | Maxim Integrated | IC LVL XLTR DUAL 8-UDFN | 在線詢價 |
|
GTL16612DL,512 | NXP USA Inc. | IC TXRX UNVRSL 18BIT 3ST SSOP56 | 在線詢價 |
 |
V62/09608-01XE | Texas Instruments | IC TRANSCVR TRI-ST 1BIT SC70-6 | 在線詢價 |
 |
GTL1655DGG,512 | NXP USA Inc. | IC TXRX BUS 16BIT 3-3.6V TSSOP64 | 在線詢價 |
 |
MC10ELT20DR2G | ON Semiconductor | IC XLATOR TTL-DIFF PECL 8-SOIC | 在線詢價 |
|
SN74LVCC4245APWR | Texas Instruments | IC BUS TRANSCEIVER 8BIT 24TSSOP | 在線詢價 |
|
NB6L16D | ON Semiconductor | IC TRANSLATOR UNIDIR 8SOIC | 在線詢價 |
|
GTL1655DGG,518 | NXP USA Inc. | IC TXRX BUS 16BIT 3-3.6V TSSOP64 | 在線詢價 |
|
CLVCC3245AIDWREP | Texas Instruments | IC BUS TRANSCVR 8BIT 24SOIC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers