購買 GRM21BC81H475KE11L與BYCHPS
購買即有保證
GRM21BC81H475KE11L
- 型號:
- GRM21BC81H475KE11L
- 描述:
- CAP CER 4.7UF 50V X6S 0805
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15900 Pieces
簡單介紹
BYCHIPS是 GRM21BC81H475KE11L的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的GRM21BC81H475KE11L購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | 0.057" (1.45mm) |
| 溫度係數: | X6S |
| 尺寸/尺寸: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| 系列: | GRM |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 0805 (2012 Metric) |
| 其他名稱: | 490-14658-2 GRM21BC81H475KE11L-ND |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | GRM21BC81H475KE11L |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | - |
| 展開說明: | 4.7µF ±10% 50V Ceramic Capacitor X6S 0805 (2012 Metric) |
| 描述: | CAP CER 4.7UF 50V X6S 0805 |
| 電容: | 4.7µF |
| 應用: | General Purpose |
| Email: | [email protected] |
GRM21BC81H475KE11L的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
GRM21BC81A226ME44L | Murata Electronics North America | CAP CER 22UF 10V X6S 0805 | 在線詢價 |
|
GRM21BC81H475KE11K | Murata Electronics North America | CAP CER 4.7UF 50V X6S 0805 | 在線詢價 |
|
GRM21BC81E106ME51L | Murata Electronics North America | CAP CER 10UF 25V X6S 0805 | 在線詢價 |
|
GRM21BC81A106KE18K | Murata Electronics North America | CAP CER 10UF 10V X6S 0805 | 在線詢價 |
|
GRM21BC81H475ME11K | Murata Electronics North America | CAP CER 4.7UF 50V X6S 0805 | 在線詢價 |
|
GRM21BC81E106KE51L | Murata Electronics North America | CAP CER 10UF 25V X6S 0805 | 在線詢價 |
|
GRM21BC81H475ME11L | Murata Electronics North America | CAP CER 4.7UF 50V X6S 0805 | 在線詢價 |
|
GRM21BC81E106ME11L | Murata Electronics North America | CAP CER 10UF 25V X6S 0805 | 在線詢價 |
|
GRM21BC81C106ME15L | Murata Electronics North America | CAP CER 10UF 16V X6S 0805 | 在線詢價 |
|
GRM21BC81E106ME11K | Murata Electronics North America | CAP CER 10UF 25V X6S 0805 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers