購買 FST32211GX與BYCHPS
購買即有保證
FST32211GX
- 型號:
- FST32211GX
- 描述:
- IC BUS SWITCH 24 1X2 114FBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17309 Pieces
- 數據表:
- FST32211GX.pdf
簡單介紹
BYCHIPS是 FST32211GX的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FST32211GX購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓電源: | Single Supply |
|---|---|
| 電壓 - 電源: | 4 V ~ 5.5 V |
| 類型: | Bus Switch |
| 供應商設備封裝: | 114-BGA (5.5x16) |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 114-LFBGA |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | FST32211GX |
| 獨立電路: | 4 |
| 展開說明: | Bus Switch 12 x 1:1 114-BGA (5.5x16) |
| 描述: | IC BUS SWITCH 24 1X2 114FBGA |
| 電流 - 輸出高，低: | - |
| 電路: | 12 x 1:1 |
| Email: | [email protected] |
FST32211GX的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers