購買 FSB67508與BYCHPS
購買即有保證
FSB67508
- 型號:
- FSB67508
- 描述:
- MODULE SPM E-BIKE SPM0-AA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17365 Pieces
- 數據表:
- FSB67508.pdf
簡單介紹
BYCHIPS是 FSB67508的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FSB67508購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 隔離: | - |
|---|---|
| 電壓: | - |
| 類型: | - |
| 系列: | - |
| 封裝/箱體: | 10-PowerSIP Module, Formed Leads |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | FSB67508 |
| 展開說明: | Power Driver Module 10-PowerSIP Module, Formed Leads |
| 描述: | MODULE SPM E-BIKE SPM0-AA |
| 當前: | - |
| 組態: | - |
| Email: | [email protected] |
FSB67508的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
FSB6714 | Fairchild/ON Semiconductor | TRANS NPN 30V 3-SSOT | 在線詢價 |
 |
FSBB30CH60F | Fairchild/ON Semiconductor | IC SMART PWR MODULE SPM27-EA | 在線詢價 |
|
FSB6726 | Fairchild/ON Semiconductor | TRANS PNP 30V 1.5A SSOT-3 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers