購買 FP1107R1-R23-R與BYCHPS
購買即有保證
FP1107R1-R23-R
- 型號:
- FP1107R1-R23-R
- 製造商:
- Bussmann (Eaton)
- 描述:
- FIXED IND 230NH 55A 0.29 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18863 Pieces
簡單介紹
BYCHIPS是 FP1107R1-R23-R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FP1107R1-R23-R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±10% |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.433" L x 0.283" W (11.00mm x 7.20mm) |
| 屏蔽: | Unshielded |
| 系列: | FLAT-PAC, FP1107 |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 513-1634-2 FP1107R1R23R |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | FP1107R1-R23-R |
| 電感: | 230nH |
| 高度 - 座高（最大）: | 0.295" (7.50mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | - |
| 展開說明: | 230nH Unshielded Wirewound Inductor 55A 0.29 mOhm Nonstandard |
| 描述: | FIXED IND 230NH 55A 0.29 MOHM |
| 直流電阻（DCR）: | 0.29 mOhm |
| 目前評級: | 55A |
| 電流 - 飽和: | 45A |
| Email: | [email protected] |
FP1107R1-R23-R的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
FP1107R2-R51-R | Eaton | FIXED IND 510NH 42A 0.47 MOHM | 在線詢價 |
 |
FP1107R1-R51-R | Eaton | FIXED IND 510NH 55A 0.29 MOHM | 在線詢價 |
|
FP1107R1-R15-R | Eaton | FIXED IND 150NH 55A 0.29 MOHM | 在線詢價 |
 |
FP1107R2-R30-R | Eaton | FIXED IND 300NH 42A 0.47 MOHM | 在線詢價 |
 |
FP1107R2-R40-R | Eaton | FIXED IND 400NH 42A 0.47 MOHM | 在線詢價 |
|
FP1107R1-R12-R | Eaton | FIXED IND 120NH 55A 0.29 MOHM | 在線詢價 |
|
FP1107R1-R30-R | Eaton | FIXED IND 300NH 55A 0.29 MOHM | 在線詢價 |
|
FP1107R2-R23-R | Eaton | FIXED IND 230NH 42A 0.47 MOHM | 在線詢價 |
|
FP1107R1-R07-R | Eaton | FIXED IND 70NH 55A 0.29 MOHM SMD | 在線詢價 |
 |
FP1107R1-R40-R | Eaton | FIXED IND 400NH 55A 0.29 MOHM | 在線詢價 |
|
FP1107R2-R12-R | Eaton | FIXED IND 120NH 42A 0.47 MOHM | 在線詢價 |
|
FP1107R2-R07-R | Eaton | FIXED IND 70NH 42A 0.47 MOHM SMD | 在線詢價 |
 |
FP1107R2-R15-R | Eaton | FIXED IND 150NH 42A 0.47 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers