購買 FMS6G20US60與BYCHPS
購買即有保證
FMS6G20US60
- 型號:
- FMS6G20US60
- 描述:
- IGBT 600V 20A 25PM-AA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17718 Pieces
- 數據表:
- FMS6G20US60.pdf
簡單介紹
BYCHIPS是 FMS6G20US60的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FMS6G20US60購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.7V @ 15V, 20A |
| 供應商設備封裝: | 25PM-AA |
| 系列: | - |
| 功率 - 最大: | 89W |
| 封裝/箱體: | 25PM-AA |
| 工作溫度: | -40°C ~ 150°C (TJ) |
| NTC熱敏電阻: | Yes |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | FMS6G20US60 |
| 輸入電容（連鎖商店）@的Vce: | 1.277nF @ 30V |
| 輸入: | Three Phase Bridge Rectifier |
| IGBT類型: | - |
| 展開說明: | IGBT Module Three Phase Inverter 600V 20A 89W Chassis Mount 25PM-AA |
| 描述: | IGBT 600V 20A 25PM-AA |
| 電流 - 集電極截止（最大）: | 250µA |
| 電流 - 集電極（Ic）（最大）: | 20A |
| 組態: | Three Phase Inverter |
| Email: | [email protected] |
FMS6G20US60的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
FMS6G20US60S | Fairchild/ON Semiconductor | IGBT 600V 20A 25PM-AA | 在線詢價 |
 |
MDI550-12A4 | IXYS | MOD IGBT BUCK 1200V 670A Y3-DCB | 在線詢價 |
 |
APT50GF120JRDQ3 | Microsemi Corporation | IGBT 1200V 120A 521W SOT227 | 在線詢價 |
|
FMS6G10US60S | Fairchild/ON Semiconductor | IGBT 600V 10A 25PM-AA | 在線詢價 |
|
FMS6G15US60 | Fairchild/ON Semiconductor | IGBT 600V 15A 25PM-AA | 在線詢價 |
|
FPF2G120BF07AS | Fairchild/ON Semiconductor | IC LOAD SWITCH | 在線詢價 |
 |
IXGN72N60C3H1 | IXYS | IGBT 78A 600V SOT-227B | 在線詢價 |
|
MII300-12A4 | IXYS | MOD IGBT RBSOA 1200V 330A Y3-DCB | 在線詢價 |
 |
CM300DY-24NF | Powerex Inc. | IGBT MOD DUAL 1200V 300A NF SER | 在線詢價 |
|
FMS6G15US60S | Fairchild/ON Semiconductor | IGBT 600V 15A 25PM-AA | 在線詢價 |
|
FMS6G10US60 | Fairchild/ON Semiconductor | IGBT 600V 10A 25PM-AA | 在線詢價 |
|
VKI50-12P1 | IXYS | MOD IGBT H-BRIDGE 1200V ECO-PAC2 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog