購買 FFE1070MS10RBL與BYCHPS
購買即有保證
FFE1070MS10RBL
- 型號:
- FFE1070MS10RBL
- 製造商:
- TDK Corporation
- 描述:
- FILTER CERAMIC 10.7MHZ RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15987 Pieces
簡單介紹
BYCHIPS是 FFE1070MS10RBL的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的FFE1070MS10RBL購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 尺寸/尺寸: | 0.315" L x 0.157" W (8.00mm x 4.00mm) |
|---|---|
| 系列: | FFE |
| 封装: | Tape & Box (TB) |
| 封裝/箱體: | 3-SIP, 2.50mm pitch |
| 其他名稱: | 445-4830-3 |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 2 (1 Year) |
| 製造商零件編號: | FFE1070MS10RBL |
| 插入損耗: | 7dB |
| 阻抗: | - |
| 高度（最大）: | 0.276" (7.00mm) |
| 頻率: | 10.7MHz Center |
| 過濾器類型: | Band Pass |
| 描述: | FILTER CERAMIC 10.7MHZ RADIAL |
| 帶寬: | 180kHz |
| Email: | [email protected] |
FFE1070MS10RBL的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CER0456B | Tusonix a Subsidiary of CTS Electronic Components | CERAMIC FILTER | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers