購買 ESHSP-5000C0-002R7與BYCHPS
購買即有保證
ESHSP-5000C0-002R7
- 型號:
- ESHSP-5000C0-002R7
- 製造商:
- Nesscap Co., Ltd
- 描述:
- CAP 5000F 0% +20% 2.7V CHAS MNT
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19306 Pieces
簡單介紹
BYCHIPS是 ESHSP-5000C0-002R7的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ESHSP-5000C0-002R7購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2.7V |
|---|---|
| 公差: | 0%, +20% |
| 終止: | Screw Terminals |
| 尺寸/尺寸: | 2.362" L x 2.835" W (60.00mm x 72.00mm) |
| 系列: | ESHSP |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can - Screw Terminals |
| 其他名稱: | 589-1018 ESHSP-5000C0-002R7-ND |
| 工作溫度: | -40°C ~ 65°C |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 7 Weeks |
| 製造商零件編號: | ESHSP-5000C0-002R7 |
| 壽命@溫度。: | - |
| 引線間距: | 1.181" (30.00mm) |
| 高度 - 座高（最大）: | 6.496" (165.00mm) |
| 展開說明: | 5000F 0%, +20%(EDLC) Supercapacitor 2.7V Radial, Can - Screw Terminals 0.25 mOhm |
| ESR（等效串聯電阻）: | 0.25 mOhm |
| 描述: | CAP 5000F 0% +20% 2.7V CHAS MNT |
| 電容: | 5000F |
| Email: | [email protected] |
ESHSP-5000C0-002R7的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
ESHSP-3500C0-002R7 | NessCap Co Ltd | CAP 3500F 0% +20% 2.7V CHAS MNT | 在線詢價 |
 |
JUC0E476MHD | Nichicon | CAP 47F 20% 2.5V THROUGH HOLE | 在線詢價 |
 |
106DER2R5SGW | Illinois Capacitor | CAP 10F -20%, +50% 2.5V T/H | 在線詢價 |
 |
ESHSR-0100C0-002R7 | NessCap Co Ltd | CAP 100F -10% +20% 2.7V T/H | 在線詢價 |
 |
ESHSP-0600C0-002R7 | NessCap Co Ltd | CAP 600F 0% +20% 2.7V CHAS MNT | 在線詢價 |
 |
ESHSR-0400C0-002R7 | NessCap Co Ltd | CAP 400F 10% 2.7V THROUGH HOLE | 在線詢價 |
 |
ESHSP-1700C0-002R7 | NessCap Co Ltd | CAP 1700F 0% +20% 2.7V CHAS MNT | 在線詢價 |
 |
PM-5R0H474-R | Eaton | CAP 470MF -20% +80% 5V T/H | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers