購買 EEC-HW0D306與BYCHPS
購買即有保證
EEC-HW0D306
- 型號:
- EEC-HW0D306
- 製造商:
- Panasonic
- 描述:
- CAP 30F -20% +40% 2.3V T/H
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15327 Pieces
簡單介紹
BYCHIPS是 EEC-HW0D306的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的EEC-HW0D306購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2.3V |
|---|---|
| 公差: | -20%, +40% |
| 終止: | Through Hole |
| 尺寸/尺寸: | 0.709" Dia (18.00mm) |
| 系列: | HW |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | EECHW0D306 P11348 |
| 工作溫度: | -25°C ~ 60°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | EEC-HW0D306 |
| 壽命@溫度。: | 1000 Hrs @ 60°C |
| 引線間距: | 0.295" (7.50mm) |
| 高度 - 座高（最大）: | 1.457" (37.00mm) |
| 展開說明: | 30F -20%, +40%(EDLC) Supercapacitor 2.3V Radial, Can 100 mOhm @ 1kHz 1000 Hrs @ 60°C |
| ESR（等效串聯電阻）: | 100 mOhm @ 1kHz |
| 描述: | CAP 30F -20% +40% 2.3V T/H |
| 電容: | 30F |
| Email: | [email protected] |
EEC-HW0D306的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers