購買 DSPIC33FJ06GS001-I/SS與BYCHPS
購買即有保證
DSPIC33FJ06GS001-I/SS
- 型號:
- DSPIC33FJ06GS001-I/SS
- 描述:
- IC MCU 16BIT 6KB FLASH 20SSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18570 Pieces
簡單介紹
BYCHIPS是 DSPIC33FJ06GS001-I/SS的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的DSPIC33FJ06GS001-I/SS購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源（Vcc / VDD）: | 3 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 20-SSOP |
| 速度: | 40 MIPs |
| 系列: | dsPIC™ 33F |
| RAM容量: | 256 x 8 |
| 程序存儲器類型: | FLASH |
| 程序存儲器大小: | 6KB (2K x 24) |
| 外設: | Brown-out Detect/Reset, POR, PWM, WDT |
| 封装: | Tube |
| 封裝/箱體: | 20-SSOP (0.209", 5.30mm Width) |
| 其他名稱: | DSPIC33FJ06GS001ISS |
| 振盪器型: | Internal |
| 工作溫度: | -40°C ~ 85°C (TA) |
| I / O數量: | 13 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | DSPIC33FJ06GS001-I/SS |
| 展開說明: | dsPIC dsPIC™ 33F Microcontroller IC 16-Bit 40 MIPs 6KB (2K x 24) FLASH 20-SSOP |
| EEPROM容量: | - |
| 描述: | IC MCU 16BIT 6KB FLASH 20SSOP |
| 數據轉換器: | A/D 6x10b |
| 核心尺寸: | 16-Bit |
| 核心處理器: | dsPIC |
| 連通性: | I²C, IrDA, LIN, SPI, UART/USART |
| Email: | [email protected] |
DSPIC33FJ06GS001-I/SS的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
DSPIC33FJ06GS001-E/SO | Microchip Technology | IC MCU 16BIT 6KB FLASH 18SOIC | 在線詢價 |
 |
DSPIC33FJ06GS001T-I/SS | Microchip Technology | IC MCU 16BIT 6KB FLASH 20SSOP | 在線詢價 |
|
DSPIC33FJ06GS001-E/SS | Microchip Technology | IC MCU 16BIT 6KB FLASH 20SSOP | 在線詢價 |
|
DSPIC33FJ06GS001-I/SO | Microchip Technology | IC MCU 16BIT 6KB FLASH 18SOIC | 在線詢價 |
|
DSPIC33FJ06GS001-E/P | Microchip Technology | IC MCU 16BIT 6KB FLASH 18DIP | 在線詢價 |
|
DSPIC33FJ06GS001T-I/SO | Microchip Technology | IC MCU 16BIT 6KB FLASH 18SOIC | 在線詢價 |
|
DSPIC33FJ06GS001-I/P | Microchip Technology | IC MCU 16BIT 6KB FLASH 18DIP | 在線詢價 |
|
DSPIC33FJ06GS001T-E/SO | Microchip Technology | IC MCU 16BIT 6KB FLASH 18SOIC | 在線詢價 |
|
DSPIC33FJ06GS001T-E/SS | Microchip Technology | IC MCU 16BIT 6KB FLASH 20SSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers