購買 DFEH7030D-100M=P3與BYCHPS
購買即有保證
DFEH7030D-100M=P3
- 型號:
- DFEH7030D-100M=P3
- 描述:
- FIXED IND 10UH 3A 82 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18433 Pieces
簡單介紹
BYCHIPS是 DFEH7030D-100M=P3的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的DFEH7030D-100M=P3購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | - |
|---|---|
| 公差: | ±20% |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.276" L x 0.260" W (7.00mm x 6.60mm) |
| 屏蔽: | Shielded |
| 系列: | DFEH7030D |
| 評級: | AEC-Q200 |
| Q因子@頻率: | - |
| 封装: | Original-Reel® |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 490-13111-6 |
| 工作溫度: | -40°C ~ 155°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Powdered Iron |
| 製造商標準交貨期: | 13 Weeks |
| 製造商零件編號: | DFEH7030D-100M=P3 |
| 電感: | 10µH |
| 高度 - 座高（最大）: | 0.118" (3.00mm) |
| 頻率 - 測試: | 100MHz |
| 頻率 - 自諧振: | - |
| 展開說明: | 10µH Shielded Inductor 3A 82 mOhm Max Nonstandard |
| 描述: | FIXED IND 10UH 3A 82 MOHM |
| 直流電阻（DCR）: | 82 mOhm Max |
| 目前評級: | 3A |
| 電流 - 飽和: | 4.2A |
| Email: | [email protected] |
DFEH7030D-100M=P3的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
DFEH7030D-2R2M=P3 | Murata Electronics North America | FIXED IND 2.2UH 7.1A 18 MOHM | 在線詢價 |
|
DFEH7030D-150M=P3 | Murata Electronics North America | FIXED IND 15UH 2.2A 147 MOHM | 在線詢價 |
|
DFEH7030D-3R3M=P3 | Murata Electronics North America | FIXED IND 3.3UH 5.4A 29 MOHM | 在線詢價 |
|
DFEH7030D-6R8M=P3 | Murata Electronics North America | FIXED IND 6.8UH 3.5A 59 MOHM | 在線詢價 |
|
DFEH7030D-1R5M=P3 | Murata Electronics North America | FIXED IND 1.5UH 7.6A 15 MOHM | 在線詢價 |
|
DFEH7030D-8R2M=P3 | Murata Electronics North America | FIXED IND 8.2UH 3.1A 78 MOHM | 在線詢價 |
|
DFEH7030D-1R0M=P3 | Murata Electronics North America | FIXED IND 1UH 9.1A 9.9 MOHM | 在線詢價 |
|
DFEH7030D-4R7M=P3 | Murata Electronics North America | FIXED IND 4.7UH 4.2A 41 MOHM | 在線詢價 |
|
DFEH7030D-5R6M=P3 | Murata Electronics North America | FIXED IND 5.6UH 3.8A 54 MOHM | 在線詢價 |
|
DFEH7030D-220M=P3 | Murata Electronics North America | FIXED IND 22UH 1.9A 198 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers