購買 D6417750RBA240HVU0與BYCHPS
購買即有保證
D6417750RBA240HVU0
- 型號:
- D6417750RBA240HVU0
- 描述:
- IC MCU 32BIT ROMLESS 256BGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14170 Pieces
簡單介紹
BYCHIPS是 D6417750RBA240HVU0的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的D6417750RBA240HVU0購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源（Vcc / VDD）: | 1.4 V ~ 1.6 V |
|---|---|
| 供應商設備封裝: | 256-BGA (27x27) |
| 速度: | 240MHz |
| 系列: | SuperH® SH7750 |
| RAM容量: | 48K x 8 |
| 程序存儲器類型: | ROMless |
| 程序存儲器大小: | - |
| 外設: | DMA, POR, WDT |
| 封装: | Tray |
| 封裝/箱體: | 256-BBGA |
| 振盪器型: | Internal |
| 工作溫度: | -40°C ~ 85°C (TA) |
| I / O數量: | 28 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 24 Weeks |
| 製造商零件編號: | D6417750RBA240HVU0 |
| 展開說明: | SH-4 SuperH® SH7750 Microcontroller IC 32-Bit 240MHz ROMless 256-BGA (27x27) |
| EEPROM容量: | - |
| 描述: | IC MCU 32BIT ROMLESS 256BGA |
| 數據轉換器: | - |
| 核心尺寸: | 32-Bit |
| 核心處理器: | SH-4 |
| 連通性: | EBI/EMI, FIFO, SCI, SmartCard |
| Email: | [email protected] |
D6417750RBA240HVU0的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
D6417709SHF200BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208QFP | 在線詢價 |
 |
ST72F361K9TCE | STMicroelectronics | IC MCU 8BIT 60KB FLASH 32LQFP | 在線詢價 |
 |
D6417729RF133BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208LQFP | 在線詢價 |
 |
D6417709SBP133BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 240LFBGA | 在線詢價 |
 |
D6417760BL200ADV | Renesas Electronics America | IC MCU 32BIT ROMLESS 256LFBGA | 在線詢價 |
|
D6417709SF100BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208LQFP | 在線詢價 |
 |
C8051F565-IM | Silicon Labs | IC MCU 8BIT 16KB FLASH 32QFN | 在線詢價 |
 |
D6417751RBA240HVU0 | Renesas Electronics America | IC MCU 32BIT ROMLESS 256BGA | 在線詢價 |
|
D6417709SF133BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 208LQFP | 在線詢價 |
|
D6417709SBP167BV | Renesas Electronics America | IC MCU 32BIT ROMLESS 240LFBGA | 在線詢價 |
 |
EFM32LG395F256G-E-BGA120R | Silicon Labs | IC MCU 32BIT 256KB FLASH 120BGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog