購買 CYUSB3014-BZXIT與BYCHPS
購買即有保證
CYUSB3014-BZXIT
- 型號:
- CYUSB3014-BZXIT
- 描述:
- IC ARM9 USB CONTROLLER 121FBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18354 Pieces
簡單介紹
BYCHIPS是 CYUSB3014-BZXIT的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CYUSB3014-BZXIT購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.15 V ~ 1.25 V |
|---|---|
| 供應商設備封裝: | 121-BGA (10x10) |
| 系列: | EZ-USB FX3™ |
| RAM容量: | 512K x 8 |
| 程序存儲器類型: | External Program Memory |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 121-TFBGA |
| 工作溫度: | -40°C ~ 85°C |
| I / O數量: | 60 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | CYUSB3014-BZXIT |
| 接口: | GPIF, I²C, I²S, SPI, UART, USB |
| 描述: | IC ARM9 USB CONTROLLER 121FBGA |
| 核心處理器: | ARM9® |
| 控制器系列: | CYUSB |
| 應用: | USB Host/Peripheral Controller |
| Email: | [email protected] |
CYUSB3014-BZXIT的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CYUSB3014-FBXCT | Cypress Semiconductor Corp | IC USB CTLR | 在線詢價 |
 |
CYUSB3014-BZXCT | Cypress Semiconductor Corp | IC USB CTLR | 在線詢價 |
|
CYUSB3014-FBXIT | Cypress Semiconductor Corp | IC USB CTLR | 在線詢價 |
|
CYUSB3012-BZXC | Cypress Semiconductor Corp | IC ARM9 USB3 CONTROLLER 121FBGA | 在線詢價 |
|
CYUSB3014-BZXC | Cypress Semiconductor Corp | IC ARM9 USB3 CONTROLLER 121FBGA | 在線詢價 |
|
CYUSB3031-BZXC | Cypress Semiconductor Corp | IC USB CTLR | 在線詢價 |
|
CYUSB3065-BZXC | Cypress Semiconductor Corp | IC EZ-USB BRIDGE 4LANE 121BGA | 在線詢價 |
|
CYUSB3064-BZXI | Cypress Semiconductor Corp | IC EZ-USB BRIDGE 2LANE 121BGA | 在線詢價 |
|
CYUSB3013-BZXC | Cypress Semiconductor Corp | IC ARM9 USB3 CONTROLLER 121FBGA | 在線詢價 |
|
CYUSB3035-BZXI | Cypress Semiconductor Corp | IC USB CTLR 3.0 121FBGA | 在線詢價 |
|
CYUSB3014-BZXI | Cypress Semiconductor Corp | IC ARM9 USB CONTROLLER 121FBGA | 在線詢價 |
|
CYUSB3011-BZXC | Cypress Semiconductor Corp | IC ARM9 USB3 CONTROLLER 121FBGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers