購買 CY62147G18-55ZSXI與BYCHPS
購買即有保證
CY62147G18-55ZSXI
- 型號:
- CY62147G18-55ZSXI
- 描述:
- IC SRAM 4MB 55NS 44TSOPII
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12303 Pieces
簡單介紹
BYCHIPS是 CY62147G18-55ZSXI的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CY62147G18-55ZSXI購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.65 V ~ 2.2 V |
|---|---|
| 供應商設備封裝: | 44-TSOP II |
| 速度: | 55ns |
| 系列: | MoBL® |
| 封装: | Tray |
| 封裝/箱體: | 44-TSOP (0.400", 10.16mm Width) |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 內存類型: | Volatile |
| 內存大小: | 4Mb (256K x 16) |
| 內存格式: | SRAM |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | CY62147G18-55ZSXI |
| 接口: | Parallel |
| 描述: | IC SRAM 4MB 55NS 44TSOPII |
| Email: | [email protected] |
CY62147G18-55ZSXI的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers