購買 CSD87355Q5DT與BYCHPS
購買即有保證
CSD87355Q5DT
- 型號:
- CSD87355Q5DT
- 製造商:
- 描述:
- MOSFET 2N-CH 30V 45A 8LSON
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18154 Pieces
- 數據表:
- CSD87355Q5DT.pdf
簡單介紹
BYCHIPS是 CSD87355Q5DT的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CSD87355Q5DT購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 1.9V @ 250µA |
|---|---|
| 供應商設備封裝: | 8-LSON (5x6) |
| 系列: | NexFET™ |
| RDS（ON）（最大值）@標識，柵極電壓: | - |
| 功率 - 最大: | 2.8W |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-PowerLDFN |
| 工作溫度: | -55°C ~ 155°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | CSD87355Q5DT |
| 輸入電容（Ciss）（Max）@ Vds: | 1860pF @ 15V |
| 柵極電荷（Qg）（Max）@ Vgs: | 13.7nC @ 4.5V |
| FET型: | 2 N-Channel (Dual) Asymmetrical |
| FET特點: | Logic Level Gate, 5V Drive |
| 展開說明: | Mosfet Array 2 N-Channel (Dual) Asymmetrical 30V 45A 2.8W Surface Mount 8-LSON (5x6) |
| 漏極至源極電壓（Vdss）: | 30V |
| 描述: | MOSFET 2N-CH 30V 45A 8LSON |
| 電流 - 25°C連續排水（Id）: | 45A |
| Email: | [email protected] |
CSD87355Q5DT的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
CSD87351Q5D | Texas Instruments | MOSFET 2N-CH 30V 32A 8LSON | 在線詢價 |
|
CSD87353Q5D | Texas Instruments | MOSFET 2N-CH 30V 40A 8LSON | 在線詢價 |
|
CSD87350Q5D | Texas Instruments | MOSFET 2N-CH 30V 40A 8LSON | 在線詢價 |
|
CSD87355Q5D | Texas Instruments | MOSFET 2N-CH 30V 8LSON | 在線詢價 |
|
CSD87333Q3D | Texas Instruments | MOSFET 2N-CH 30V 15A 8SON | 在線詢價 |
|
CSD87351ZQ5D | Texas Instruments | MOSFET 2N-CH 30V 32A 8LSON | 在線詢價 |
|
CSD87352Q5D | Texas Instruments | MOSFET 2N-CH 30V 25A 8SON | 在線詢價 |
|
CSD87335Q3D | Texas Instruments | MOSFET N-CH 30V POWERBLOCK | 在線詢價 |
|
CSD87381P | Texas Instruments | MOSFET 2N-CH 30V 15A 5PTAB | 在線詢價 |
|
CSD87384M | Texas Instruments | MOSFET 2N-CH 30V 30A 5PTAB | 在線詢價 |
|
CSD87331Q3D | Texas Instruments | MOSFET 2N-CH 30V 15A 8SON | 在線詢價 |
|
CSD87312Q3E | Texas Instruments | MOSFET 2N-CH 30V 27A 8VSON | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers