購買 CSD75205W1015與BYCHPS
購買即有保證
CSD75205W1015
- 型號:
- CSD75205W1015
- 製造商:
- 描述:
- MOSFET 2P-CH 20V 1.2A 6DSBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16384 Pieces
簡單介紹
BYCHIPS是 CSD75205W1015的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CSD75205W1015購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 850mV @ 250µA |
|---|---|
| 供應商設備封裝: | 6-DSBGA (1x1.5) |
| 系列: | NexFET™ |
| RDS（ON）（最大值）@標識，柵極電壓: | 120 mOhm @ 1A, 4.5V |
| 功率 - 最大: | 750mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6-UFBGA, DSBGA |
| 其他名稱: | 296-25335-2 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | CSD75205W1015 |
| 輸入電容（Ciss）（Max）@ Vds: | 265pF @ 10V |
| 柵極電荷（Qg）（Max）@ Vgs: | 2.2nC @ 4.5V |
| FET型: | 2 P-Channel (Dual) |
| FET特點: | Logic Level Gate |
| 展開說明: | Mosfet Array 2 P-Channel (Dual) 20V 1.2A 750mW Surface Mount 6-DSBGA (1x1.5) |
| 漏極至源極電壓（Vdss）: | 20V |
| 描述: | MOSFET 2P-CH 20V 1.2A 6DSBGA |
| 電流 - 25°C連續排水（Id）: | 1.2A |
| Email: | [email protected] |
CSD75205W1015的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
CSD75204W15 | Texas Instruments | MOSFET 2P-CH 3A 9DSBGA | 在線詢價 |
|
CSD75208W1015 | Texas Instruments | MOSFET 2P-CH 20V 1.6A 6WLP | 在線詢價 |
|
CSD75207W15 | Texas Instruments | MOSFET 2P-CH 3.9A 9DSBGA | 在線詢價 |
|
CSD75211W1723 | Texas Instruments | MOSFET 2P-CH 20V 4.5A 12DSBGA | 在線詢價 |
|
CSD75208W1015T | Texas Instruments | MOSFET 2P-CH 20V 1.6A 6WLP | 在線詢價 |
 |
NTLUD3A260PZTBG | ON Semiconductor | MOSFET 2P-CH 20V 1.3A UDFN6 | 在線詢價 |
 |
SI4816DY-T1-GE3 | Vishay Siliconix | MOSFET 2N-CH 30V 5.3A 8-SOIC | 在線詢價 |
 |
FDC6506P | Fairchild/ON Semiconductor | MOSFET 2P-CH 30V 1.8A SSOT6 | 在線詢價 |
 |
IRF8852TRPBF | Infineon Technologies | MOSFET 2N-CH 25V 7.8A 8TSSOP | 在線詢價 |
|
CSD75301W1015 | Texas Instruments | MOSFET 2P-CH 20V 1.2A 6DSBGA | 在線詢價 |
 |
MP6K13TCR | Rohm Semiconductor | MOSFET 2N-CH 30V 6A MPT6 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers