購買 CS3與BYCHPS
購買即有保證
CS3
- 型號:
- CS3
- 製造商:
- Bussmann (Eaton)
- 描述:
- COVER SHIELD POLY BASE NH 3
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19643 Pieces
- 數據表:
- CS3.pdf
簡單介紹
BYCHIPS是 CS3的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CS3購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 系列: | NH |
|---|---|
| 其他名稱: | CS3BS |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | CS3 |
| 適用於/相關產品: | Fuseholder; NH3 |
| 描述: | COVER SHIELD POLY BASE NH 3 |
| 附件類型: | Cap (Cover) |
| Email: | [email protected] |
CS3的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
1PH4P25MM | Littelfuse Inc. | BUSBAR 1 PHASE 4 POLE 25MM | 在線詢價 |
 |
0853.1202 | Schurter Inc. | FUSE CARRIER OGN 5X20MM | 在線詢價 |
 |
CS00 | Eaton | TERMINAL COVER 160A NH00 | 在線詢價 |
|
CS1 | Eaton | COVER SHIELD POLY BASE NH 1 | 在線詢價 |
|
25GD27 | Eaton | GAUGE PIECE D2 25A 500V FOR E27 | 在線詢價 |
|
3298900.Z | Littelfuse Inc. | SHUNT ZCASE MEGA 32V | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers