購買 CPL2508T4R7M與BYCHPS
購買即有保證
CPL2508T4R7M
- 型號:
- CPL2508T4R7M
- 製造商:
- TDK Corporation
- 描述:
- FIXED IND 4.7UH 430MA 550 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16126 Pieces
- 數據表:
- CPL2508T4R7M.pdf
簡單介紹
BYCHIPS是 CPL2508T4R7M的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CPL2508T4R7M購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±20% |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.098" L x 0.059" W (2.50mm x 1.50mm) |
| 屏蔽: | Shielded |
| 系列: | CPL |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 445-6148-2 |
| 工作溫度: | -40°C ~ 105°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商零件編號: | CPL2508T4R7M |
| 電感: | 4.7µH |
| 高度 - 座高（最大）: | 0.031" (0.80mm) |
| 頻率 - 自諧振: | - |
| 展開說明: | 4.7µH Shielded Wirewound Inductor 430mA 715 mOhm Max Nonstandard |
| 描述: | FIXED IND 4.7UH 430MA 550 MOHM |
| 直流電阻（DCR）: | 715 mOhm Max |
| 目前評級: | 430mA |
| 電流 - 飽和: | 430mA |
| Email: | [email protected] |
CPL2508T4R7M的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CPL2508T2R2M | TDK Corporation | FIXED IND 2.2UH 700MA 165 MOHM | 在線詢價 |
|
CPL2508T150M | TDK Corporation | FIXED IND 15UH 230MA 2 OHM SMD | 在線詢價 |
|
CPL2508T3R3M | TDK Corporation | FIXED IND 3.3UH 500MA 360 MOHM | 在線詢價 |
|
CPL2508T1R5M | TDK Corporation | FIXED IND 1.5UH 800MA 140 MOHM | 在線詢價 |
|
CPL2508T1R0M | TDK Corporation | FIXED IND 1UH 950MA 110 MOHM SMD | 在線詢價 |
 |
CPL2512T1R5M | TDK Corporation | FIXED IND 1.5UH 1A 120 MOHM SMD | 在線詢價 |
|
CPL2508T220M | TDK Corporation | FIXED IND 22UH 180MA 2.4 OHM SMD | 在線詢價 |
|
CPL2512T6R8M | TDK Corporation | FIXED IND 6.8UH 450MA 700 MOHM | 在線詢價 |
|
CPL2508T6R8M | TDK Corporation | FIXED IND 6.8UH 300MA 1 OHM SMD | 在線詢價 |
|
CPL2508T100M | TDK Corporation | FIXED IND 10UH 270MA 1.5 OHM SMD | 在線詢價 |
|
CPL2512T1R0M | TDK Corporation | FIXED IND 1UH 1.3A 90 MOHM SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers