購買 CKG45KX7R1H335M290JH與BYCHPS
購買即有保證
CKG45KX7R1H335M290JH
- 型號:
- CKG45KX7R1H335M290JH
- 製造商:
- TDK Corporation
- 描述:
- CAP CER 3.3UF 50V X7R SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19426 Pieces
簡單介紹
BYCHIPS是 CKG45KX7R1H335M290JH的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CKG45KX7R1H335M290JH購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±20% |
| 厚度（最大）: | 0.118" (3.00mm) |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.197" L x 0.138" W (5.00mm x 3.50mm) |
| 系列: | MEGACAP, CKG |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard SMD |
| 其他名稱: | 445-4087-2 CKG45KX7R1H335M CKG45KX7R1H335MT009W |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 18 Weeks |
| 製造商零件編號: | CKG45KX7R1H335M290JH |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | Low ESL |
| 失敗率: | - |
| 展開說明: | 3.3µF ±20% 50V Ceramic Capacitor X7R Nonstandard SMD |
| 描述: | CAP CER 3.3UF 50V X7R SMD |
| 電容: | 3.3µF |
| 應用: | SMPS Filtering, Bypass, Decoupling |
| Email: | [email protected] |
CKG45KX7R1H335M290JH的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CKG45KX7R1C106M290JH | TDK Corporation | CAP CER 10UF 16V X7R SMD | 在線詢價 |
|
CKG45KX7R1H335K290JH | TDK Corporation | CAP CER 3.3UF 50V X7R SMD | 在線詢價 |
|
CKG45KX7R1H335M290JJ | TDK Corporation | CAP CER 3.3UF 50V X7R SMD | 在線詢價 |
|
CKG45KX7R1C106K290JJ | TDK Corporation | CAP CER 10UF 16V X7R SMD | 在線詢價 |
|
CKG45KX7R1H155M290JJ | TDK Corporation | CAP CER 1.5UF 50V X7R SMD | 在線詢價 |
|
CKG45KX7R1C106M290JJ | TDK Corporation | CAP CER 10UF 16V X7R SMD | 在線詢價 |
|
CKG45KX7R1H335K290JJ | TDK Corporation | CAP CER 3.3UF 50V X7R SMD | 在線詢價 |
|
CKG45KX7R1E475M290JJ | TDK Corporation | CAP CER 4.7UF 25V X7R SMD | 在線詢價 |
|
CKG45KX7R1H155K290JJ | TDK Corporation | CAP CER 1.5UF 50V X7R SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers