購買 CKG32KX7R2E104K335AJ與BYCHPS
購買即有保證
CKG32KX7R2E104K335AJ
- 型號:
- CKG32KX7R2E104K335AJ
- 製造商:
- TDK Corporation
- 描述:
- CAP CER 0.1UF 250V X7R SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19719 Pieces
簡單介紹
BYCHIPS是 CKG32KX7R2E104K335AJ的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CKG32KX7R2E104K335AJ購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 250V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | 0.136" (3.45mm) |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.142" L x 0.102" W (3.60mm x 2.60mm) |
| 系列: | MEGACAP, CKG |
| 評級: | AEC-Q200 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard SMD |
| 其他名稱: | 445-10306-2 CKG32KX7R2E104KT0Y0W |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 18 Weeks |
| 製造商零件編號: | CKG32KX7R2E104K335AJ |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | Low ESL |
| 失敗率: | - |
| 展開說明: | 0.1µF ±10% 250V Ceramic Capacitor X7R Nonstandard SMD |
| 描述: | CAP CER 0.1UF 250V X7R SMD |
| 電容: | 0.1µF |
| 應用: | Automotive, SMPS Filtering, Bypass, Decoupling |
| Email: | [email protected] |
CKG32KX7R2E104K335AJ的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CKG32KX7R2E104M335AJ | TDK Corporation | CAP CER 0.1UF 250V X7R SMD | 在線詢價 |
|
CKG32KX7R2E104K335AH | TDK Corporation | CAP CER 0.1UF 250V X7R SMD | 在線詢價 |
|
CKG32KX7R2A105M335AH | TDK Corporation | CAP CER 1UF 100V X7R SMD | 在線詢價 |
|
CKG32KX7R2A474M335AH | TDK Corporation | CAP CER 0.47UF 100V X7R SMD | 在線詢價 |
|
CKG32KX7R2A474M335AJ | TDK Corporation | CAP CER 0.47UF 100V X7R SMD | 在線詢價 |
|
CKG32KX7R2A105K335AH | TDK Corporation | CAP CER 1UF 100V X7R SMD | 在線詢價 |
|
CKG32KX7R2A225K335AH | TDK Corporation | CAP CER 2.2UF 100V X7R SMD | 在線詢價 |
|
CKG32KX7R2A105M335AJ | TDK Corporation | CAP CER 1UF 100V X7R SMD | 在線詢價 |
|
CKG32KX7R2E104M335AH | TDK Corporation | CAP CER 0.1UF 250V X7R SMD | 在線詢價 |
|
CKG32KX7R2A225M335AJ | TDK Corporation | CAP CER 2.2UF 100V X7R SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers