購買 CDR32BX393AKSR7185與BYCHPS
購買即有保證
CDR32BX393AKSR7185
- 型號:
- CDR32BX393AKSR7185
- 製造商:
- KEMET
- 描述:
- CAP CER 0.039UF 50V BX 1206
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 19282 Pieces
簡單介紹
BYCHIPS是 CDR32BX393AKSR7185的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CDR32BX393AKSR7185購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | 0.051" (1.30mm) |
| 溫度係數: | BX |
| 尺寸/尺寸: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| 系列: | Military, MIL-PRF-55681, CDR32 |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1206 (3216 Metric) |
| 其他名稱: | 1001-2438-2 1001-2438-2-MIL |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 21 Weeks |
| 製造商零件編號: | CDR32BX393AKSR7185 |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | Military |
| 失敗率: | R (0.01%) |
| 展開說明: | 0.039µF ±10% 50V Ceramic Capacitor BX 1206 (3216 Metric) |
| 描述: | CAP CER 0.039UF 50V BX 1206 |
| 電容: | 0.039µF |
| 應用: | General Purpose |
| Email: | [email protected] |
CDR32BX393AKSR7185的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CDR32BX333AKWS7185 | KEMET | CAP CER 0.033UF 50V BX 1206 | 在線詢價 |
|
CDR32BP102BKUS7370 | KEMET | CAP CER 1000PF 100V BP 1206 | 在線詢價 |
|
CDR32BX393AKUS7370 | KEMET | CAP CER 0.039UF 50V BX 1206 | 在線詢價 |
|
CDR32BP102BJUS7185 | KEMET | CAP CER 1000PF 100V BP 1206 | 在線詢價 |
|
CDR32BX393AKUS7185 | KEMET | CAP CER 0.039UF 50V BX 1206 | 在線詢價 |
|
CDR32BP470BKUS7185 | KEMET | CAP CER 47PF 100V BP 1206 | 在線詢價 |
|
CDR32BX103BKWS | KEMET | CAP CER 10000PF 100V BX 1206 | 在線詢價 |
|
CDR32BX333AKUS7185 | KEMET | CAP CER 0.033UF 50V BX 1206 | 在線詢價 |
|
CDR32BP102BKUS7956 | KEMET | CAP CER 1000PF 100V BP 1206 | 在線詢價 |
|
CDR32BP331BKUS7185 | KEMET | CAP CER 330PF 100V BP 1206 | 在線詢價 |
|
CDR32BP221BKUS7185 | KEMET | CAP CER 220PF 100V BP 1206 | 在線詢價 |
|
CDR32BX103BKUS7185 | KEMET | CAP CER 10000PF 100V BX 1206 | 在線詢價 |
|
CDR32BP102BKWS7370 | KEMET | CAP CER 1000PF 100V BP 1206 | 在線詢價 |
|
CDR32BP101BJUS7185 | KEMET | CAP CER 100PF 100V BP 1206 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers