購買 CDMT40D30HF-6R8NC與BYCHPS
購買即有保證
CDMT40D30HF-6R8NC
- 型號:
- CDMT40D30HF-6R8NC
- 描述:
- FIXED IND 6.8UH 2.7A 62 MOHM SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16216 Pieces
簡單介紹
BYCHIPS是 CDMT40D30HF-6R8NC的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CDMT40D30HF-6R8NC購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | - |
|---|---|
| 公差: | ±30% |
| 尺寸/尺寸: | 0.163" L x 0.163" W (4.15mm x 4.15mm) |
| 屏蔽: | Unshielded |
| 系列: | CDMT |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 308-2376-2 |
| 工作溫度: | - |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | - |
| 製造商標準交貨期: | 21 Weeks |
| 製造商零件編號: | CDMT40D30HF-6R8NC |
| 電感: | 6.8µH |
| 高度 - 座高（最大）: | 0.083" (2.10mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | - |
| 展開說明: | 6.8µH Unshielded Inductor 2.7A 62 mOhm Nonstandard |
| 描述: | FIXED IND 6.8UH 2.7A 62 MOHM SMD |
| 直流電阻（DCR）: | 62 mOhm |
| 目前評級: | 2.7A |
| 電流 - 飽和: | 3.4A |
| Email: | [email protected] |
CDMT40D30HF-6R8NC的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CDMT40D30HF-3R3NC | Sumida America Components Inc. | FIXED IND 3.3UH 4.3A 23 MOHM SMD | 在線詢價 |
|
CDMT40D20HF-R47NC | Sumida America Components Inc. | FIXED IND 470NH 6.8A 8.3 MOHM | 在線詢價 |
|
CDMT40D20HF-1R5NC | Sumida America Components Inc. | FIXED IND 1.5UH 4.4A 21.5 MOHM | 在線詢價 |
|
CDMT40D20HF-2R2NC | Sumida America Components Inc. | FIXED IND 2.2UH 3.5A 30.8 MOHM | 在線詢價 |
|
CDMT40D20HF-1R0NC | Sumida America Components Inc. | FIXED IND 1UH 5.4A 14.5 MOHM SMD | 在線詢價 |
|
CDMT40D30HF-4R7NC | Sumida America Components Inc. | FIXED IND 4.7UH 3.6A 37 MOHM SMD | 在線詢價 |
|
CDMT40D20HF-R63NC | Sumida America Components Inc. | FIXED IND 630NH 6.1A 10.3 MOHM | 在線詢價 |
|
CDMT40D20HF-R27NC | Sumida America Components Inc. | FIXED IND 270NH 7.5A 6.4 MOHM | 在線詢價 |
|
CDMT40D20HF-3R3NC | Sumida America Components Inc. | FIXED IND 3.3UH 3A 46.2 MOHM SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers