購買 CDLC122P2R7K04與BYCHPS
購買即有保證
CDLC122P2R7K04
- 型號:
- CDLC122P2R7K04
- 描述:
- CAP 1200F 0% +20% 2.7V CHAS MNT
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19932 Pieces
簡單介紹
BYCHIPS是 CDLC122P2R7K04的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CDLC122P2R7K04購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2.7V |
|---|---|
| 公差: | - |
| 終止: | Screw Terminals |
| 尺寸/尺寸: | 2.390" Dia (60.70mm) |
| 系列: | CDLC |
| 封装: | Tray |
| 封裝/箱體: | Axial, Can - Screw Terminals |
| 其他名稱: | 338-3376 |
| 工作溫度: | -40°C ~ 65°C |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | CDLC122P2R7K04 |
| 壽命@溫度。: | 1000 Hrs @ 65°C |
| 引線間距: | - |
| 高度 - 座高（最大）: | 2.925" (74.30mm) |
| 展開說明: | 1200F (EDLC) Supercapacitor 2.7V Axial, Can - Screw Terminals 0.58 mOhm 1000 Hrs @ 65°C |
| ESR（等效串聯電阻）: | 0.58 mOhm |
| 描述: | CAP 1200F 0% +20% 2.7V CHAS MNT |
| 電容: | 1200F |
| Email: | [email protected] |
CDLC122P2R7K04的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
FT0H105ZF | KEMET | CAP 1F -20% +80% 5.5V T/H | 在線詢價 |
 |
EEC-RF0H684N | Panasonic Electronic Components | CAP .68F 5.5V T/H | 在線詢價 |
 |
CDLC152P2R7K04 | Cornell Dubilier Electronics (CDE) | CAP 1500F 0% +20% 2.7V CHAS MNT | 在線詢價 |
 |
JJC0E276MELB | Nichicon | CAP 27F 20% 2.5V THROUGH HOLE | 在線詢價 |
 |
DZ-2R5D665Z6T | Elna America | CAP 6.6F -20% +80% 2.5V T/H | 在線詢價 |
 |
BMOD0006 E160 B02 | Maxwell Technologies Inc. | CAP 5.8F 160V M5 THREAD | 在線詢價 |
 |
EEC-HW0D706 | Panasonic Electronic Components | CAP 70F -20% +40% 2.1V T/H | 在線詢價 |
 |
EEC-F5R5U474N | Panasonic Electronic Components | CAP .47F 5.5V T/H | 在線詢價 |
 |
CDLC101K2R7SR | Cornell Dubilier Electronics (CDE) | CAP 100F -5% +10% 2.7V T/H | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers