購買 CDCVF310PWRG4與BYCHPS
購買即有保證
CDCVF310PWRG4
- 型號:
- CDCVF310PWRG4
- 製造商:
- 描述:
- IC CLK BUF 1:10 200MHZ 24TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17236 Pieces
簡單介紹
BYCHIPS是 CDCVF310PWRG4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CDCVF310PWRG4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.3 V ~ 3.6 V |
|---|---|
| 類型: | Fanout Buffer (Distribution) |
| 供應商設備封裝: | 24-TSSOP |
| 系列: | - |
| 比率 - 輸入：輸出: | 1:10 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 24-TSSOP (0.173", 4.40mm Width) |
| 產量: | LVTTL |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | CDCVF310PWRG4 |
| 輸入: | LVTTL |
| 頻率 - 最大: | 200MHz |
| 展開說明: | Clock Fanout Buffer (Distribution) IC 200MHz 24-TSSOP (0.173", 4.40mm Width) |
| 差分 - 輸入：輸出: | No/No |
| 描述: | IC CLK BUF 1:10 200MHZ 24TSSOP |
| Email: | [email protected] |
CDCVF310PWRG4的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
CDCVF310PWG4 | Texas Instruments | IC CLK BUF 1:10 200MHZ 24TSSOP | 在線詢價 |
|
CDCVF2509APWR | Texas Instruments | IC 3.3V PLL CLK-DRVR 24-TSSOP | 在線詢價 |
|
CDCVF310PW | Texas Instruments | IC CLK BUF 1:10 200MHZ 24TSSOP | 在線詢價 |
|
CDCVF857RHARG4 | Texas Instruments | IC 2.5V PHASE LOCK LOOP 40VQFN | 在線詢價 |
|
CDCVF2510PWG4 | Texas Instruments | IC 3.3V PLL CLK-DRVR 24-TSSOP | 在線詢價 |
|
CDCVF857ZQLR | Texas Instruments | IC PLL CLOCK DVR 2.5V 56BGA | 在線詢價 |
|
CDCVF25081DRG4 | Texas Instruments | IC 1:8 3.3V PLL CLK-DRVR 16-SOIC | 在線詢價 |
|
CDCVF111FN | Texas Instruments | IC CLK BUFFER 1:9 650MHZ 28PLCC | 在線詢價 |
|
CDCVF310PWR | Texas Instruments | IC CLK BUF 1:10 200MHZ 24TSSOP | 在線詢價 |
|
CDCVF2310PWR | Texas Instruments | IC CLK BUF 1:10 200MHZ 24TSSOP | 在線詢價 |
|
CDCVF2510PW | Texas Instruments | IC 3.3V PLL CLK-DRVR 24-TSSOP | 在線詢價 |
|
CDCVF857DGGG4 | Texas Instruments | IC 2.5V PHASE LOCK LOOP 48-TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers