購買 CCR05CG222GP與BYCHPS
購買即有保證
CCR05CG222GP
- 型號:
- CCR05CG222GP
- 製造商:
- KEMET
- 描述:
- CAP CER 2200PF 50V 2% RADIAL
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17593 Pieces
- 數據表:
- CCR05CG222GP.pdf
簡單介紹
BYCHIPS是 CCR05CG222GP的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CCR05CG222GP購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±2% |
| 厚度（最大）: | - |
| 溫度係數: | C0G, NP0 |
| 尺寸/尺寸: | 0.190" L x 0.090" W (4.83mm x 2.29mm) |
| 系列: | Military, MIL-PRF-20, CCR05 |
| 評級: | - |
| 封装: | Bulk |
| 封裝/箱體: | Radial |
| 其他名稱: | C05G222G5G5CP CCR05CG222GP-MIL |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | CCR05CG222GP |
| 引線型: | Formed Leads |
| 引線間距: | 0.200" (5.08mm) |
| 高度 - 座高（最大）: | 0.200" (5.08mm) |
| 特徵: | Military |
| 失敗率: | P (0.1%) |
| 展開說明: | 2200pF ±2% 50V Ceramic Capacitor C0G, NP0 Radial |
| 描述: | CAP CER 2200PF 50V 2% RADIAL |
| 電容: | 2200pF |
| 應用: | General Purpose |
| Email: | [email protected] |
CCR05CG222GP的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
CCR05CG271FPV | KEMET | CAP CER 270PF 200V 1% RADIAL | 在線詢價 |
|
CCR05CG222GM | KEMET | CAP CER 2200PF 50V 2% RADIAL | 在線詢價 |
|
CCR05CG271FMV | KEMET | CAP CER 270PF 200V 1% RADIAL | 在線詢價 |
|
CCR05CG222GR | KEMET | CAP CER 2200PF 50V 2% RADIAL | 在線詢價 |
|
CCR05CG102JP | KEMET | CAP CER 1000PF 100V 5% RADIAL | 在線詢價 |
|
CCR05CG471JP | KEMET | CAP CER 470PF 100V 5% RADIAL | 在線詢價 |
|
CCR05CG101JR | KEMET | CAP CER 100PF 200V 5% RADIAL | 在線詢價 |
|
CCR05CG102FM | KEMET | CAP CER 1000PF 100V 1% RADIAL | 在線詢價 |
|
CCR05CG101JP | KEMET | CAP CER 100PF 200V 5% RADIAL | 在線詢價 |
|
CCR05CG151JP | KEMET | CAP CER 150PF 200V 5% RADIAL | 在線詢價 |
|
CCR05CG151JR | KEMET | CAP CER 150PF 200V 5% RADIAL | 在線詢價 |
 |
CCR05CG271FRV | KEMET | CAP CER 270PF 200V 1% RADIAL | 在線詢價 |
|
CCR05CG152JM | KEMET | CAP CER 1500PF 100V 5% RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers