購買 CB182D0475KBC與BYCHPS
購買即有保證
CB182D0475KBC
- 型號:
- CB182D0475KBC
- 製造商:
- AVX Corporation
- 描述:
- CAP FILM 4.7UF 10% 63VDC 6054
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14849 Pieces
簡單介紹
BYCHIPS是 CB182D0475KBC的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的CB182D0475KBC購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 63V |
|---|---|
| 額定電壓 - AC: | 40V |
| 公差: | ±10% |
| 終止: | Solder Pads |
| 尺寸/尺寸: | 0.602" L x 0.539" W (15.30mm x 13.70mm) |
| 系列: | CB |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6054 (153137 Metric) |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 29 Weeks |
| 製造商零件編號: | CB182D0475KBC |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | - |
| 展開說明: | 4.7µF ±10% Film Capacitor 40V 63V Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked 6054 (153137 Metric) |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked |
| 描述: | CAP FILM 4.7UF 10% 63VDC 6054 |
| 電容: | 4.7µF |
| 應用: | General Purpose |
| Email: | [email protected] |
CB182D0475KBC的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers