購買 C2225C394K5RALTU與BYCHPS
購買即有保證
C2225C394K5RALTU
- 型號:
- C2225C394K5RALTU
- 製造商:
- KEMET
- 描述:
- CAP CER 0.39UF 50V X7R 2225
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 18770 Pieces
簡單介紹
BYCHIPS是 C2225C394K5RALTU的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的C2225C394K5RALTU購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 50V |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | 0.045" (1.15mm) |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.221" L x 0.252" W (5.60mm x 6.40mm) |
| 系列: | L |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 2225 (5763 Metric) |
| 其他名稱: | C2225C394K5RAL C2225C394K5RAL7800 |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 22 Weeks |
| 製造商零件編號: | C2225C394K5RALTU |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | - |
| 失敗率: | - |
| 展開說明: | 0.39µF ±10% 50V Ceramic Capacitor X7R 2225 (5763 Metric) |
| 描述: | CAP CER 0.39UF 50V X7R 2225 |
| 電容: | 0.39µF |
| 應用: | General Purpose |
| Email: | [email protected] |
C2225C394K5RALTU的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
C2225C394K1RACTU | KEMET | CAP CER 0.39UF 100V X7R 2225 | 在線詢價 |
 |
C2225C333G5GACTU | KEMET | CAP CER 0.033UF 50V NP0 2225 | 在線詢價 |
|
C2225C394M2RACTU | KEMET | CAP CER 0.39UF 200V X7R 2225 | 在線詢價 |
 |
C2225C392JGGACTU | KEMET | CAP CER 3900PF 2KV C0G/NP0 2225 | 在線詢價 |
 |
C2225C333F5GALTU | KEMET | CAP CER 0.033UF 50V NP0 2225 | 在線詢價 |
|
C2225C334K1RACTU | KEMET | CAP CER 0.33UF 100V X7R 2225 | 在線詢價 |
 |
C2225C334K5RACTU | KEMET | CAP CER 0.33UF 50V X7R 2225 | 在線詢價 |
|
C2225C334K2RACTU | KEMET | CAP CER 0.33UF 200V X7R 2225 | 在線詢價 |
|
C2225C334M5UACTU | KEMET | CAP CER 0.33UF 50V Z5U 2225 | 在線詢價 |
|
C2225C393JCGACTU | KEMET | CAP CER 0.039UF 500V NP0 2225 | 在線詢價 |
|
C2225C333J5GACTU | KEMET | CAP CER 0.033UF 50V NP0 2225 | 在線詢價 |
|
C2225C334M1RACTU | KEMET | CAP CER 0.33UF 100V X7R 2225 | 在線詢價 |
|
C2225C333F5GACTU | KEMET | CAP CER 0.033UF 50V NP0 2225 | 在線詢價 |
|
C2225C334J1RACTU | KEMET | CAP CER 0.33UF 100V X7R 2225 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers