購買 C1825C822KGRACTU與BYCHPS
購買即有保證
C1825C822KGRACTU
- 型號:
- C1825C822KGRACTU
- 製造商:
- KEMET
- 描述:
- CAP CER 8200PF 2KV X7R 1825
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19653 Pieces
簡單介紹
BYCHIPS是 C1825C822KGRACTU的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的C1825C822KGRACTU購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2000V (2kV) |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | 0.061" (1.55mm) |
| 溫度係數: | X7R |
| 尺寸/尺寸: | 0.177" L x 0.252" W (4.50mm x 6.40mm) |
| 系列: | C |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1825 (4564 Metric) |
| 其他名稱: | 399-4853-2 C1825C822KGRAC C1825C822KGRAC7800 |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount, MLCC |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 21 Weeks |
| 製造商零件編號: | C1825C822KGRACTU |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | High Voltage |
| 失敗率: | - |
| 展開說明: | 8200pF ±10% 2000V (2kV) Ceramic Capacitor X7R 1825 (4564 Metric) |
| 描述: | CAP CER 8200PF 2KV X7R 1825 |
| 電容: | 8200pF |
| 應用: | SMPS Filtering |
| Email: | [email protected] |
C1825C822KGRACTU的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
C1825C821GZGACTU | KEMET | CAP CER 820PF 2.5KV NP0 1825 | 在線詢價 |
|
C1825C823KCRACTU | KEMET | CAP CER 0.082UF 500V X7R 1825 | 在線詢價 |
|
C1825C824K5RACTU | KEMET | CAP CER 0.82UF 50V X7R 1825 | 在線詢價 |
|
C1825C822J1GACTU | KEMET | CAP CER 8200PF 100V NP0 1825 | 在線詢價 |
|
C1825C821KGGACTU | KEMET | CAP CER 820PF 2KV NP0 1825 | 在線詢價 |
|
C1825C822J2GACTU | KEMET | CAP CER 8200PF 200V NP0 1825 | 在線詢價 |
|
C1825C822G5GACTU | KEMET | CAP CER 8200PF 50V NP0 1825 | 在線詢價 |
|
C1825C822JGRACTU | KEMET | CAP CER 8200PF 2KV X7R 1825 | 在線詢價 |
|
C1825C822J5GACTU | KEMET | CAP CER 8200PF 50V NP0 1825 | 在線詢價 |
|
C1825C821MZGACTU | KEMET | CAP CER 820PF 2.5KV NP0 1825 | 在線詢價 |
|
C1825C821FZGACTU | KEMET | CAP CER 820PF 2.5KV NP0 1825 | 在線詢價 |
|
C1825C821JZGACTU | KEMET | CAP CER 820PF 2.5KV C0G/NP0 1825 | 在線詢價 |
|
C1825C821KZGACTU | KEMET | CAP CER 820PF 2.5KV NP0 1825 | 在線詢價 |
|
C1825C822MGRACTU | KEMET | CAP CER 8200PF 2KV X7R 1825 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers